STM32H755IIK6

STM32H755IIK6

STM32H755IIK3

STM32H755IIK3

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STM32H755IIT6

High-performance and DSP with DP-FPU, Arm Cortex-M7 + Cortex-M4 MCU with 2MBytes of Flash memory, 1MB RAM, 480 MHz CPU, Art Accelerator, L1 cache, external memory interface, large set of peripherals including a Crypto accelerator, SMPS

Supply Voltage Min Volt1.62
Supply Voltage Max Volt3.6
Operating Temp Min Celsius-40.0
Operating Temp Max Celsius85.0
CoreArm Cortex-M4
ECCN US5A992.c
ECCN EUNEC
Packing TypeTray
RoHs compliantEcopack2
GradeIndustrial
Package NameLQFP 176 24x24x1.4 mm

STM32H755xI devices are based on the high-performance Arm® Cortex®-M7 and Cortex®-M4 32-bit RISC cores. The Cortex®-M7 core operates at up to 480 MHz and the Cortex®-M4 core at up to 240 MHz. Both cores feature a floating point unit (FPU) which supports Arm® single- and double-precision...
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Key features
  • Dual core
    • 32-bit Arm® Cortex®-M7 core with double-precision FPU and L1 cache: 16 Kbytes of data and 16 Kbytes of instruction cache; frequency up to 480 MHz, MPU, 1027 DMIPS/ 2.14 DMIPS/MHz (Dhrystone 2.1), and DSP instructions
    • 32-bit Arm® 32-bit Cortex®-M4 core with FPU, Adaptive real-time accelerator (ART Accelerator™) for internal Flash memory and external memories, frequency up to 240 MHz, MPU, 300 DMIPS/1.25 DMIPS /MHz (Dhrystone 2.1), and DSP instructions
  • Memories
    • 2 Mbytes of Flash memory with read-while-write support
    • 1 Mbyte of RAM: 192 Kbytes of TCM RAM (inc. 64 Kbytes of ITCM RAM + 128 Kbytes of DTCM RAM for time critical routines), 864 Kbytes of user SRAM, and 4 Kbytes of SRAM in Backup domain
    • Dual mode Quad-SPI memory interface running up to 133 MHz
    • Flexible external memory controller with up to 32-bit data bus: SRAM, PSRAM, SDRAM/LPSDR SDRAM, NOR/NAND Flash memory clocked up to 125 MHz in Synchronous mode
    • CRC calculation unit
  • Security
    • ROP, PC-ROP, active tamper, secure firmware upgrade support, Secure access mode
  • General-purpose input/outputs
    • Up to 168 I/O ports with interrupt capability
  • Reset and power management
    • 3 separate power domains which can be independently clock-gated or switched off:
      • D1: high-performance capabilities
      • D2: communication peripherals and timers
      • D3: reset/clock control/power management
    • 1.62 to 3.6 V application supply and I/Os
    • POR, PDR, PVD and BOR
    • Dedicated USB power embedding a 3.3 V internal regulator to supply the internal PHYs
    • Embedded regulator (LDO) to supply the digital circuitry
    • High power-efficiency SMPS step-down converter regulator to directly supply VCORE and/or external circuitry
    • Voltage scaling in Run and Stop mode (6 configurable ranges)
    • Backup regulator (~0.9 V)
    • Voltage
In stock
Quantity $ per unit Savings
1-9$19.690%
10-24$18.108%
25-399$15.2922%
400-1199$14.4826%
1200-10000$14.2428%
Contact sales
$19.69
$19.69
Supply Voltage Min Volt1.62
Supply Voltage Max Volt3.6
Operating Temp Min Celsius-40.0
Operating Temp Max Celsius85.0
CoreArm Cortex-M4
ECCN US5A992.c
ECCN EUNEC
Packing TypeTray
RoHs compliantEcopack2
GradeIndustrial
Package NameLQFP 176 24x24x1.4 mm

STM32H755xI devices are based on the high-performance Arm® Cortex®-M7 and Cortex®-M4 32-bit RISC cores. The Cortex®-M7 core operates at up to 480 MHz and the Cortex®-M4 core at up to 240 MHz. Both cores feature a floating point unit (FPU) which supports Arm® single- and double-precision...
Read More

Key features
  • Dual core
    • 32-bit Arm® Cortex®-M7 core with double-precision FPU and L1 cache: 16 Kbytes of data and 16 Kbytes of instruction cache; frequency up to 480 MHz, MPU, 1027 DMIPS/ 2.14 DMIPS/MHz (Dhrystone 2.1), and DSP instructions
    • 32-bit Arm® 32-bit Cortex®-M4 core with FPU, Adaptive real-time accelerator (ART Accelerator™) for internal Flash memory and external memories, frequency up to 240 MHz, MPU, 300 DMIPS/1.25 DMIPS /MHz (Dhrystone 2.1), and DSP instructions
  • Memories
    • 2 Mbytes of Flash memory with read-while-write support
    • 1 Mbyte of RAM: 192 Kbytes of TCM RAM (inc. 64 Kbytes of ITCM RAM + 128 Kbytes of DTCM RAM for time critical routines), 864 Kbytes of user SRAM, and 4 Kbytes of SRAM in Backup domain
    • Dual mode Quad-SPI memory interface running up to 133 MHz
    • Flexible external memory controller with up to 32-bit data bus: SRAM, PSRAM, SDRAM/LPSDR SDRAM, NOR/NAND Flash memory clocked up to 125 MHz in Synchronous mode
    • CRC calculation unit
  • Security
    • ROP, PC-ROP, active tamper, secure firmware upgrade support, Secure access mode
  • General-purpose input/outputs
    • Up to 168 I/O ports with interrupt capability
  • Reset and power management
    • 3 separate power domains which can be independently clock-gated or switched off:
      • D1: high-performance capabilities
      • D2: communication peripherals and timers
      • D3: reset/clock control/power management
    • 1.62 to 3.6 V application supply and I/Os
    • POR, PDR, PVD and BOR
    • Dedicated USB power embedding a 3.3 V internal regulator to supply the internal PHYs
    • Embedded regulator (LDO) to supply the digital circuitry
    • High power-efficiency SMPS step-down converter regulator to directly supply VCORE and/or external circuitry
    • Voltage scaling in Run and Stop mode (6 configurable ranges)
    • Backup regulator (~0.9 V)
    • Voltage
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