STM32MP157CAC3

MPU with Arm Dual Cortex-A7 650 MHz, Arm Cortex-M4 real-time coprocessor, 3D GPU, TFT/MIPI DSI displays, FD-CAN, Secure boot and Cryptography

Parameters

Supply Voltage Min Volt	1.71
Supply Voltage Max Volt	3.6
Operating Temp Min Celsius	-40.0
Operating Temp Max Celsius	125.0
Core	Arm Cortex-A7
ECCN US	5A992.c
ECCN EU	NEC
Packing Type	Tray
RoHs compliant	Ecopack2
Grade	Industrial
Package Name	TFBGA 361 12x12x1.2 P 0.5 mm

Description

The STM32MP157C/F devices are based on the high-performance dual-core Arm® Cortex®-A7 32-bit RISC core operating at up to 800 MHz. The Cortex-A7 processor includes a 32-Kbyte L1 instruction cache for each CPU, a 32-Kbyte L1 data cache for each CPU and a 256-Kbyte level2 cache. The Cortex-A7...
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The STM32MP157C/F devices are based on the high-performance dual-core Arm^® Cortex^®-A7 32-bit RISC core operating at up to 800 MHz. The Cortex-A7 processor includes a 32-Kbyte L1 instruction cache for each CPU, a 32-Kbyte L1 data cache for each CPU and a 256-Kbyte level2 cache. The Cortex-A7 processor is a very energy-efficient application processor designed to provide rich performance in high-end wearables, and other low-power embedded and consumer applications. It provides up to 20% more single thread performance than the Cortex-A5 and provides similar performance than the Cortex-A9.

The Cortex-A7 incorporates all features of the high-performance Cortex-A15 and Cortex-A17 processors, including virtualization support in hardware, NEON™, and 128-bit AMBA^®4 AXI bus interface.

The STM32MP157C/F devices also embed a Cortex^® -M4 32-bit RISC core operating at up to 209 MHz frequency. Cortex-M4 core features a floating point unit (FPU) single precision which supports Arm^® single-precision data-processing instructions and data types. The Cortex^® -M4 supports a full set of DSP instructions and a memory protection unit (MPU) which enhances application security.

The STM32MP157C/F devices also embed a 3D graphic processing unit (Vivante^® - OpenGL^® ES 2.0) running at up to 533 MHz, with performances up to 26 Mtriangle/s, 133 Mpixel/s.

The STM32MP157C/F devices provide an external SDRAM interface supporting external memories up to 8-Gbit density (1 Gbyte), 16 or 32-bit LPDDR2/LPDDR3 or DDR3/DDR3L up to 533 MHz.

The STM32MP157C/F devices incorporate high-speed embedded memories with 708 Kbytes of Internal SRAM (including 256 Kbytes of AXI SYSRAM, 3 banks of 128 Kbytes each of AHB SRAM, 64 Kbytes of AHB SRAM in backup domain and 4 Kbytes of SRAM in backup domain), as well as an extensive range of enhanced I/Os and peripherals connected to APB buses, AHB buses, a 32-bit multi-AHB bus matrix and a 64-bit multi layer AXI interconnect supporting internal and external memories access.

All the devices offer two ADCs, two DACs, a low-power RTC, 12 general-purpose 16-bit timers, two PWM timers for motor control, five low-power timers, a true random number generator (RNG), and a cryptographic acceleration cell. The devices support six digital filters for external sigma delta modulators (DFSDM). They also feature standard and advanced communication interfaces.

Key features

Key features
Core 32-bit dual-core Arm^® Cortex^®-A7 L1 32-Kbyte I / 32-Kbyte D for each core 256-Kbyte unified level 2 cache Arm^® NEON™ and Arm^® TrustZone^® 32-bit Arm^® Cortex^®-M4 with FPU/MPU Up to 209 MHz (Up to 703 CoreMark^®) Memories External DDR memory up to 1 Gbyte up to LPDDR2/LPDDR3-1066 16/32-bit up to DDR3/DDR3L-1066 16/32-bit 708 Kbytes of internal SRAM: 256 Kbytes of AXI SYSRAM + 384 Kbytes of AHB SRAM + 64 Kbytes of AHB SRAM in Backup domain and 4 Kbytes of SRAM in Backup domain Dual mode Quad-SPI memory interface Flexible external memory controller with up to 16-bit data bus: parallel interface to connect external ICs and SLC NAND memories with up to 8-bit ECC Security/safety Secure boot, TrustZone^® peripherals, active tamper Cortex^®-M4 resources isolation Reset and power management 1.71 V to 3.6 V I/Os supply (5 V-tolerant I/Os) POR, PDR, PVD and BOR On-chip LDOs (RETRAM, BKPSRAM, DSI 1.2 V, USB 1.8 V, 1.1 V) Backup regulator (~0.9 V) Internal temperature sensors Low-power modes: Sleep, Stop and Standby DDR memory retention in Standby mode Controls for PMIC companion chip Low-power consumption Total current consumption down to 2 µA (Standby mode, no RTC, no LSE, no BKPSRAM, no RETRAM) Clock management Internal oscillators: 64 MHz HSI oscillator, 4 MHz CSI oscillator, 32 kHz LSI oscillator

In stock

Quantity	$ per unit	Savings
1-9	$15.77	0%
10-24	$12.51	21%
25-49	$11.68	26%
50-99	$10.91	31%
100-249	$10.40	34%
250-10000	$10.14	36%
10000 +	Contact sales

$15.77