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STM32MP157FAA1

STM32MP157FAA1

STM32MP157FAB1

STM32MP157FAB1

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STM32MP157FAD1

MPU with Arm Dual Cortex-A7 800 MHz, Arm Cortex-M4 real-time coprocessor, 3D GPU, TFT/MIPI DSI displays, FD-CAN, Secure boot and Cryptography

Supply Voltage Min Volt1.71
Supply Voltage Max Volt3.6
CoreArm Cortex-A7
ECCN US5A992.c
ECCN EUNEC
Packing TypeTray
RoHs compliantEcopack2
GradeIndustrial
Package NameTFBGA 257 10x10x1.2 P 0.5 mm

The STM32MP157C/F devices are based on the high-performance dual-core Arm® Cortex®-A7 32-bit RISC core operating at up to 800 MHz. The Cortex-A7 processor includes a 32-Kbyte L1 instruction cache for each CPU, a 32-Kbyte L1 data cache for each CPU and a 256-Kbyte level2 cache. The Cortex-A7...
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Key features
  • Core
    • 32-bit dual-core Arm® Cortex®-A7
      • L1 32-Kbyte I / 32-Kbyte D for each core

      • 256-Kbyte unified level 2 cache

      • Arm® NEON™ and Arm® TrustZone®

    • 32-bit Arm® Cortex®-M4 with FPU/MPU
      • Up to 209 MHz (Up to 703 CoreMark®)

  • Memories
    • External DDR memory up to 1 Gbyte
      • up to LPDDR2/LPDDR3-1066 16/32-bit

      • up to DDR3/DDR3L-1066 16/32-bit

    • 708 Kbytes of internal SRAM: 256 Kbytes of AXI SYSRAM + 384 Kbytes of AHB SRAM + 64 Kbytes of AHB SRAM in Backup domain and 4 Kbytes of SRAM in Backup domain
    • Dual mode Quad-SPI memory interface
    • Flexible external memory controller with up to 16-bit data bus: parallel interface to connect external ICs and SLC NAND memories with up to 8-bit ECC
  • Security/safety
    • Secure boot, TrustZone® peripherals, active tamper
    • Cortex®-M4 resources isolation
  • Reset and power management
    • 1.71 V to 3.6 V I/Os supply (5 V-tolerant I/Os)
    • POR, PDR, PVD and BOR
    • On-chip LDOs (RETRAM, BKPSRAM, DSI 1.2 V, USB 1.8 V, 1.1 V)
    • Backup regulator (~0.9 V)
    • Internal temperature sensors
    • Low-power modes: Sleep, Stop and Standby
    • DDR memory retention in Standby mode
    • Controls for PMIC companion chip
  • Low-power consumption
    • Total current consumption down to 2 µA (Standby mode, no RTC, no LSE, no BKPSRAM, no RETRAM)
  • Clock management
    • Internal oscillators: 64 MHz HSI oscillator, 4 MHz CSI oscillator, 32 kHz LSI oscillator
In stock
Quantity $ per unit Savings
1-9$19.440%
10-24$17.888%
25-99$17.1312%
100-249$15.0922%
250-499$14.3626%
500-1103$13.4331%
1104-10000$12.9134%
Contact sales
$19.44
$19.44
or
Supply Voltage Min Volt1.71
Supply Voltage Max Volt3.6
CoreArm Cortex-A7
ECCN US5A992.c
ECCN EUNEC
Packing TypeTray
RoHs compliantEcopack2
GradeIndustrial
Package NameTFBGA 257 10x10x1.2 P 0.5 mm

The STM32MP157C/F devices are based on the high-performance dual-core Arm® Cortex®-A7 32-bit RISC core operating at up to 800 MHz. The Cortex-A7 processor includes a 32-Kbyte L1 instruction cache for each CPU, a 32-Kbyte L1 data cache for each CPU and a 256-Kbyte level2 cache. The Cortex-A7...
Read More

Key features
  • Core
    • 32-bit dual-core Arm® Cortex®-A7
      • L1 32-Kbyte I / 32-Kbyte D for each core

      • 256-Kbyte unified level 2 cache

      • Arm® NEON™ and Arm® TrustZone®

    • 32-bit Arm® Cortex®-M4 with FPU/MPU
      • Up to 209 MHz (Up to 703 CoreMark®)

  • Memories
    • External DDR memory up to 1 Gbyte
      • up to LPDDR2/LPDDR3-1066 16/32-bit

      • up to DDR3/DDR3L-1066 16/32-bit

    • 708 Kbytes of internal SRAM: 256 Kbytes of AXI SYSRAM + 384 Kbytes of AHB SRAM + 64 Kbytes of AHB SRAM in Backup domain and 4 Kbytes of SRAM in Backup domain
    • Dual mode Quad-SPI memory interface
    • Flexible external memory controller with up to 16-bit data bus: parallel interface to connect external ICs and SLC NAND memories with up to 8-bit ECC
  • Security/safety
    • Secure boot, TrustZone® peripherals, active tamper
    • Cortex®-M4 resources isolation
  • Reset and power management
    • 1.71 V to 3.6 V I/Os supply (5 V-tolerant I/Os)
    • POR, PDR, PVD and BOR
    • On-chip LDOs (RETRAM, BKPSRAM, DSI 1.2 V, USB 1.8 V, 1.1 V)
    • Backup regulator (~0.9 V)
    • Internal temperature sensors
    • Low-power modes: Sleep, Stop and Standby
    • DDR memory retention in Standby mode
    • Controls for PMIC companion chip
  • Low-power consumption
    • Total current consumption down to 2 µA (Standby mode, no RTC, no LSE, no BKPSRAM, no RETRAM)
  • Clock management
    • Internal oscillators: 64 MHz HSI oscillator, 4 MHz CSI oscillator, 32 kHz LSI oscillator
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