NRND
Automotive 8-bit ultra-low-power MCU with 64 Kbytes Flash, LIN, RTC, data EEPROM, timers, USARTs, I2C, SPIs, ADC, DAC, COMPs
Supply Voltage Min Volt | 1.8 |
Supply Voltage Max Volt | 3.6 |
Operating Temp Min Celsius | -40.0 |
Operating Temp Max Celsius | 125.0 |
Core | STM8 |
ECCN US | EAR99 |
ECCN EU | NEC |
Packing Type | Tray |
RoHs compliant | Ecopack2 |
Grade | Automotive |
Package Name | LQFP 48 7x7x1.4 mm |
The high-density STM8AL3x8x ultra-low-power devices feature an enhanced STM8 CPU core providing increased processing power (up to 16 MIPS at 16 MHz) while maintaining the advantages of a CISC architecture with improved code density, a 24-bit linear addressing space and an optimized architecture for...
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Quantity | $ per unit | Savings |
---|---|---|
1-9 | $4.44 | 0% |
10-249 | $2.29 | 48% |
250-1499 | $2.08 | 53% |
1500-10000 | $2.07 | 53% |
10000 + |
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Supply Voltage Min Volt | 1.8 |
Supply Voltage Max Volt | 3.6 |
Operating Temp Min Celsius | -40.0 |
Operating Temp Max Celsius | 125.0 |
Core | STM8 |
ECCN US | EAR99 |
ECCN EU | NEC |
Packing Type | Tray |
RoHs compliant | Ecopack2 |
Grade | Automotive |
Package Name | LQFP 48 7x7x1.4 mm |
The high-density STM8AL3x8x ultra-low-power devices feature an enhanced STM8 CPU core providing increased processing power (up to 16 MIPS at 16 MHz) while maintaining the advantages of a CISC architecture with improved code density, a 24-bit linear addressing space and an optimized architecture for...
Read More
|