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Automotive 8-bit ultra-low-power MCU with 64 Kbytes Flash, LIN, RTC, data EEPROM, timers, USARTs, I2C, SPIs, ADC, DAC, COMPs, AES
Supply Voltage Min Volt | 1.8 |
Supply Voltage Max Volt | 3.6 |
Operating Temp Min Celsius | -40.0 |
Operating Temp Max Celsius | 85.0 |
Core | STM8 |
ECCN US | 5A992.c |
ECCN EU | NEC |
Packing Type | Tray |
RoHs compliant | Ecopack2 |
Grade | Automotive |
Package Name | LQFP 80 14x14x1.4 mm |
The high-density STM8AL3xE8x ultra-low-power devices feature an enhanced STM8 CPU core providing increased processing power (up to 16 MIPS at 16 MHz) while maintaining the advantages of a CISC architecture with improved code density, a 24-bit linear addressing space and an optimized architecture...
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Quantity | $ per unit | Savings |
---|---|---|
1-9 | $5.82 | 0% |
10-99 | $5.22 | 10% |
100-539 | $4.28 | 26% |
540-1079 | $3.64 | 38% |
1080-2699 | $3.38 | 42% |
2700-10000 | $3.28 | 44% |
10000 + |
Contact sales |
Supply Voltage Min Volt | 1.8 |
Supply Voltage Max Volt | 3.6 |
Operating Temp Min Celsius | -40.0 |
Operating Temp Max Celsius | 85.0 |
Core | STM8 |
ECCN US | 5A992.c |
ECCN EU | NEC |
Packing Type | Tray |
RoHs compliant | Ecopack2 |
Grade | Automotive |
Package Name | LQFP 80 14x14x1.4 mm |
The high-density STM8AL3xE8x ultra-low-power devices feature an enhanced STM8 CPU core providing increased processing power (up to 16 MIPS at 16 MHz) while maintaining the advantages of a CISC architecture with improved code density, a 24-bit linear addressing space and an optimized architecture...
Read More
|