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Ultra-low-power 8-bit MCU with 64 Kbytes Flash, 16 MHz CPU, integrated EEPROM
| Supply Voltage Min Volt | 1.65 |
| Supply Voltage Max Volt | 3.6 |
| Operating Temp Min Celsius | -40.0 |
| Operating Temp Max Celsius | 85.0 |
| Core | STM8 |
| ECCN US | EAR99 |
| ECCN EU | NEC |
| Packing Type | Tape And Reel |
| RoHs compliant | Ecopack2 |
| Grade | Industrial |
| Package Name | WLCSP 32 1.9x3.4x0.6 P 0.4 mm |
The high-density and medium+ density STM8L15xx6/8 ultra-low-power devices feature an enhanced STM8 CPU core providing increased processing power (up to 16 MIPS at 16 MHz) while maintaining the advantages of a CISC architecture with improved code density, a 24-bit linear addressing space and an...
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| Quantity | $ per unit | Savings |
|---|---|---|
| 1-9 | $4.13 | 34% |
| 10-24 | $2.72 | 11% |
| 25-99 | $2.49 | 19% |
| 100-249 | $2.11 | 31% |
| 250-499 | $2.00 | 35% |
| 500-999 | $1.79 | 42% |
| 1000-10000 | $1.53 | 50% |
| 10000 + |
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| Supply Voltage Min Volt | 1.65 |
| Supply Voltage Max Volt | 3.6 |
| Operating Temp Min Celsius | -40.0 |
| Operating Temp Max Celsius | 85.0 |
| Core | STM8 |
| ECCN US | EAR99 |
| ECCN EU | NEC |
| Packing Type | Tape And Reel |
| RoHs compliant | Ecopack2 |
| Grade | Industrial |
| Package Name | WLCSP 32 1.9x3.4x0.6 P 0.4 mm |
The high-density and medium+ density STM8L15xx6/8 ultra-low-power devices feature an enhanced STM8 CPU core providing increased processing power (up to 16 MIPS at 16 MHz) while maintaining the advantages of a CISC architecture with improved code density, a 24-bit linear addressing space and an...
Read More
|