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STPayBio

Biometric System on Card proof of concept for fingerprint-authenticated payment transactions

Core ProductST31
GradeIndustrial

The STPayBio proof of concept (POC) demonstrates high performance biometric authenticated transactions based on either contact or contactless modes. A full transaction is performed in less than 1.2 s including a complete match and payment.The solution is based on the most advanced products form...
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Key features
  • Hardware key features
    • Card holder identification through dual-interface card biometric system
    • Based on STMicroelectronics secure element (SE) and STMicroelectronics low-power silicon microcontroller
    • 40 nm ST31 secure element:
      • To perform secure banking transactions, store biometric templates and carry out secure card matching

      • To perform energy harvesting provided by the SE with no battery, nor super cap

    • STM32L443 microcontroller:
      • To perform fast Low-power mode biometric extractions for enrollment and at each transaction

    • Latest generation FPC 1323 Sensor 6 contacts module on 35 mm tape
    • System in package (SIP) 8-pin ISO module on 35 mm tape via LINXENS
    • Prelam® in custom sheet formats, including RF ID1 antenna and connectivity via LINXENS
  • Software content
    • SE OS compliant with Java® Card 3.0.5 and GlobalPlatform® GPC 2.3.1 coupled with Financial configuration v1.0.2
    • MasterCard® applet based on M/Chip® advance 1.2.3 specification targeting MasterCard® Biometric system on chip compliancy
    • Proprietary enrollment applet
    • Extraction and matching algorithms based on fingerprint cards (FPC) libraries
  • Key benefits
    • Complete biometric system on card solution (through partners)
    • Reduced BOM
    • Matching with the secure element
    • High performance solution when used for both contact and contactless modes including matching.
    • Compatible with different enrollment processes
    • Easy integration with standard card manufacturers:
      • Hot lamination of the card body

      • ISO module and sensor on 35 mm tape

      • Yield loss reduction with module embedding at the final stage of card manufacturing

    • Secure solution with False Acceptation Rate (FAR) <1/10000 and False Rejection Rate (FRR) <3%
  • Support for validation and development
    • Application companion board
Out of Stock
Quantity $ per unit Savings
1-500$0.000%
Contact sales
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Core ProductST31
GradeIndustrial

The STPayBio proof of concept (POC) demonstrates high performance biometric authenticated transactions based on either contact or contactless modes. A full transaction is performed in less than 1.2 s including a complete match and payment.The solution is based on the most advanced products form...
Read More

Key features
  • Hardware key features
    • Card holder identification through dual-interface card biometric system
    • Based on STMicroelectronics secure element (SE) and STMicroelectronics low-power silicon microcontroller
    • 40 nm ST31 secure element:
      • To perform secure banking transactions, store biometric templates and carry out secure card matching

      • To perform energy harvesting provided by the SE with no battery, nor super cap

    • STM32L443 microcontroller:
      • To perform fast Low-power mode biometric extractions for enrollment and at each transaction

    • Latest generation FPC 1323 Sensor 6 contacts module on 35 mm tape
    • System in package (SIP) 8-pin ISO module on 35 mm tape via LINXENS
    • Prelam® in custom sheet formats, including RF ID1 antenna and connectivity via LINXENS
  • Software content
    • SE OS compliant with Java® Card 3.0.5 and GlobalPlatform® GPC 2.3.1 coupled with Financial configuration v1.0.2
    • MasterCard® applet based on M/Chip® advance 1.2.3 specification targeting MasterCard® Biometric system on chip compliancy
    • Proprietary enrollment applet
    • Extraction and matching algorithms based on fingerprint cards (FPC) libraries
  • Key benefits
    • Complete biometric system on card solution (through partners)
    • Reduced BOM
    • Matching with the secure element
    • High performance solution when used for both contact and contactless modes including matching.
    • Compatible with different enrollment processes
    • Easy integration with standard card manufacturers:
      • Hot lamination of the card body

      • ISO module and sensor on 35 mm tape

      • Yield loss reduction with module embedding at the final stage of card manufacturing

    • Secure solution with False Acceptation Rate (FAR) <1/10000 and False Rejection Rate (FRR) <3%
  • Support for validation and development
    • Application companion board