STSAFA110DFSPL03

Authentication, state-of-the-art security for peripherals and IoT devices

Parameters

Supply Voltage Min Volt	1.8
Supply Voltage Max Volt	5.5
ECCN US	3A991.a.2
ECCN EU	NEC
Packing Type	Tape And Reel
RoHs compliant	N/A
Grade	Industrial
Package Name	UFDFPN 8 2x3x0.6

Description

The STSAFE-A110 is a highly secure solution that acts as a secure element providing authentication and secure data management services to a local or remote host. It consists of a full turnkey solution with a secure operating system running on the latest generation of secure microcontrollers.The...
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Key features

Key features
Authentication for: Consumables and peripherals eCloud Internet of things (IoT) connected objects USB Type-C™ power delivery chargers Qi over-the-air chargers Secure channel establishment with remote host including transport layer security (TLS) handshake Signature verification service (secure boot and firmware upgrade) Usage monitoring with secure counters Pairing and secure channel with host application processor Wrapping and unwrapping of local host envelopes Symmetric data encryption or decryption (up to 16 keys) On-chip key pair generation LPWAN security ready: Preloading with Sigfox™ or LoRaWAN^® credentials Frame signature and verification Frame encryption and decryption Security features Latest generation of highly secure MCUs Unique serial number on each die CC EAL5+ AVA_VAN5 Common Criteria certified Active shield Monitoring of environmental parameters Protection mechanism against faults Protection against side-channel attacks Advanced asymmetric cryptography Elliptic curve cryptography (ECC) with NIST or Brainpool 256-bit and 384-bit curves Elliptic curve digital signature algorithm (ECDSA) with SHA-256 and SHA-384 for digital signature generation and verification Elliptic curve Diffie-Hellman (ECDH) for key establishment Advanced symmetric cryptography Secure operating system with protection against logical and physical attacks Secure operating system Secure STSAFE-A110 kernel for authentication and data management Protection against logical and physical attacks Hardware features 6 Kbytes of configurable non-volatile memory Highly reliable CMOS EEPROM technology 30 years’ data retention at 25 °C 500 000 erase / program cycles endurance at 25 °C 1.62 V to 5.5 V continuous supply voltage Protocol I²C-bus slave interface Up to 400 kbps transmission speed (Fast mode) and true open-drain pads 7-bit addressing Packages ECOPACK-compliant SO8N 8-lead plastic small outline and UFDFPN 8-lead ultra thin profile fine pitch dual flat packages

Out of Stock

Quantity	$ per unit	Savings
1-9	$2.32	34%
10-24	$1.99	44%
25-99	$1.92	46%
100-249	$1.80	49%
250-499	$1.72	51%
500	$1.37	61%
500 +	Contact sales

Special Price $2.32 Regular Price $3.53

Parameters

Supply Voltage Min Volt	1.8
Supply Voltage Max Volt	5.5
ECCN US	3A991.a.2
ECCN EU	NEC
Packing Type	Tape And Reel
RoHs compliant	N/A
Grade	Industrial
Package Name	UFDFPN 8 2x3x0.6

Description

Key features

Key features
Authentication for: Consumables and peripherals eCloud Internet of things (IoT) connected objects USB Type-C™ power delivery chargers Qi over-the-air chargers Secure channel establishment with remote host including transport layer security (TLS) handshake Signature verification service (secure boot and firmware upgrade) Usage monitoring with secure counters Pairing and secure channel with host application processor Wrapping and unwrapping of local host envelopes Symmetric data encryption or decryption (up to 16 keys) On-chip key pair generation LPWAN security ready: Preloading with Sigfox™ or LoRaWAN^® credentials Frame signature and verification Frame encryption and decryption Security features Latest generation of highly secure MCUs Unique serial number on each die CC EAL5+ AVA_VAN5 Common Criteria certified Active shield Monitoring of environmental parameters Protection mechanism against faults Protection against side-channel attacks Advanced asymmetric cryptography Elliptic curve cryptography (ECC) with NIST or Brainpool 256-bit and 384-bit curves Elliptic curve digital signature algorithm (ECDSA) with SHA-256 and SHA-384 for digital signature generation and verification Elliptic curve Diffie-Hellman (ECDH) for key establishment Advanced symmetric cryptography Secure operating system with protection against logical and physical attacks Secure operating system Secure STSAFE-A110 kernel for authentication and data management Protection against logical and physical attacks Hardware features 6 Kbytes of configurable non-volatile memory Highly reliable CMOS EEPROM technology 30 years’ data retention at 25 °C 500 000 erase / program cycles endurance at 25 °C 1.62 V to 5.5 V continuous supply voltage Protocol I²C-bus slave interface Up to 400 kbps transmission speed (Fast mode) and true open-drain pads 7-bit addressing Packages ECOPACK-compliant SO8N 8-lead plastic small outline and UFDFPN 8-lead ultra thin profile fine pitch dual flat packages