STSAFL010DFSPL01

Authentication & Brand protection secure solution

Parameters

Supply Voltage Min Volt	1.62
Supply Voltage Max Volt	5.5
Operating Temp Min Celsius	-25.0
Operating Temp Max Celsius	85.0
ECCN US	3A991.a.2
ECCN EU	NEC
Packing Type	Tape And Reel
RoHs compliant	N/A
Grade	Industrial
Package Name	UFDFPN 8 2x3x0.6

Description

The STSAFE-L010 system-on-chip is a secure element providing authentication and data management services to a local host.The primary function of the STSAFE-L010 is to allow the peripheral or consumable to which it is attached to be authenticated by a host for the latter to discriminate between...
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Key features

Key features
Authentication of consumables and peripherals Usage monitoring with secure counters Nonvolatile memory zones with user-defined access rights Security features Secure system solution Secure MCU Secure STSAFE-L010 operating system for authentication and data management Unique serial number on each die Monitoring of environmental parameters Protection mechanism against faults Protection against side-channel attacks Advanced asymmetric cryptography Advanced asymmetric cryptography relying on ECC with 256 bits key length (Edwards curves Ed25519) Hardware features 32 Kbytes of secure nonvolatile memory Flash memory 10 years data retention at 25°C 100 000 erase/program cycles endurance at 25°C Supply voltage 1.62 V to 5.5 V Operating temperature: −25°C to 85°C Protocol ST1Wire communication interface on one I/O Up to 100 kbps communication speed I²C communication interface Up to 100 kHz communication speed 7-bit addressing mode Packages ECOPACK-compliant UFDFPN 8-lead ultrathin profile fine pitch dual flat packages X2F-PSON6 package (under commercial conditions) XDFN3 package for direct contact (under commercial conditions)

In stock

Quantity	$ per unit	Savings
1-9	$2.52	0%
10-24	$1.63	35%
25-99	$1.45	42%
100-249	$1.20	53%
250-499	$1.13	55%
500	$0.98	61%
500 +	Contact sales

$2.52

Parameters

Supply Voltage Min Volt	1.62
Supply Voltage Max Volt	5.5
Operating Temp Min Celsius	-25.0
Operating Temp Max Celsius	85.0
ECCN US	3A991.a.2
ECCN EU	NEC
Packing Type	Tape And Reel
RoHs compliant	N/A
Grade	Industrial
Package Name	UFDFPN 8 2x3x0.6

Description

Key features

Key features
Authentication of consumables and peripherals Usage monitoring with secure counters Nonvolatile memory zones with user-defined access rights Security features Secure system solution Secure MCU Secure STSAFE-L010 operating system for authentication and data management Unique serial number on each die Monitoring of environmental parameters Protection mechanism against faults Protection against side-channel attacks Advanced asymmetric cryptography Advanced asymmetric cryptography relying on ECC with 256 bits key length (Edwards curves Ed25519) Hardware features 32 Kbytes of secure nonvolatile memory Flash memory 10 years data retention at 25°C 100 000 erase/program cycles endurance at 25°C Supply voltage 1.62 V to 5.5 V Operating temperature: −25°C to 85°C Protocol ST1Wire communication interface on one I/O Up to 100 kbps communication speed I²C communication interface Up to 100 kHz communication speed 7-bit addressing mode Packages ECOPACK-compliant UFDFPN 8-lead ultrathin profile fine pitch dual flat packages X2F-PSON6 package (under commercial conditions) XDFN3 package for direct contact (under commercial conditions)