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TS4621EIJT

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High-performance class G stereo headphone amplifier with I2C volume control

Quantity $ per Unit Savings
1 - 9$2.510%
10 - 99$1.6634%
100 - 499$1.1654%
500$1.1355%
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In stock
$2.51
Parameter NameParameter Value
Supply Voltage Min Volt2.3
Supply Voltage Max Volt4.8
Operating Temp Min Celsius-40.0
Operating Temp Max Celsius85.0
ECCN USEAR99
ECCN EUNEC
Packing TypeTape And Reel
ROHS Compliance GradeEcopack3
GradeIndustrial
Package NameCSP P 0.4 mm

The TS4621E is a class-G stereo headphone driver dedicated to high audio performance, high power efficiency and space-constrained applications.


It is based on the core technology of a low power dissipation amplifier combined with a high-efficiency buck converter for supplying this amplifier.


When powered by a battery, the buck converter generates the appropriate voltage to the amplifier depending on the amplitude of the audio signal to supply the headsets. It achieves a total 2.1 mA current consumption at 100 μW output power (10 dB crest factor).


THD+N is 0.02% maximum at 1 kHz and PSRR is 100 dB at 217 Hz, which ensures a high audio quality of the device in a wide range of environments.


The traditionally bulky output coupling capacitors can be removed.


A dedicated common-mode sense pin removes parasitic ground noise.


The TS4621E is designed to be used with an output serial resistor. It ensures unconditional stability over a wide range of capacitive loads.


The TS4621E is packaged in a tiny 16-bump flip-chip package with a pitch of 400 μm.

Key features
  • Power supply range: 2.3 V to 4.8 V
  • 0.6 mA/channel quiescent current
  • 2.1 mA current consumption with 100 μW/channel (10 dB crest factor)
  • 0.006% typical THD+N at 1 kHz
  • 100 dB typical PSRR at 217 Hz
  • 100 dB of SNR A-weighted at G = 0 dB
  • Zero pop and click
  • I2C interface for volume control
  • Digital volume control range from -60 dB to +4 dB
  • Independent right and left channel shutdown control
  • Integrated high-efficiency buck converter
  • Low software standby current: 5 μA max
  • Output-coupling capacitors removed
  • Thermal shutdown and short-circuit protection
  • Flip-chip package: 1.65 mm x 1.65 mm, 400 μm pitch, 16 bumps