Active

New

VB56G3CAGK

VB56G3 1.53-megapixel monochrome global shutter CMOS image sensor in OBGA package packed in tray

Operating Temp Min Celsius-30.0
Operating Temp Max Celsius85.0
ECCN USEAR99
ECCN EUNEC
Package Size6.2 x 6.9
Packing TypeTray
RoHs compliantEcopack2
GradeIndustrial
Package NameOBGA

The VD56G3 and VB56G3 are 1.5-megapixel monochrome CMOS image sensors that deliver exceptional imaging performance in a compact form factor. Built on STMicroelectronics' proprietary technologies, including BSI and full CDTI, they achieve superior QE (quantum efficiency), MTF (modulation transfer...
Read More

Key features
  • Resolution: 1.53 MP (1124 x 1364)
  • Chroma: Monochrome
  • Optical format: 1/4’’ (4.61 mm)
  • State-of-the-art pixel technology:
    • Pixel pitch: 2.61 µm
    • Shutter type: Global shutter
    • Technologies: GS (global shutter), BSI (backside illumination), CDTI (continuous digital time integration), and 3D stacking (three-dimensional stacking).
  • Embedded features:
    • Image quality optimization: Autoexposure, defective pixel correction, binning, and more.
    • Data and frame rate optimization: Cropping, subsampling, and more.
    • Others: Context management, temperature sensor, and more.
  • Interfaces:
    • Output: MIPI CSI-2 (1 or 2 lanes) with RAW8 and RAW10 output formats
    • Control: I²C
  • Comprehensive evaluation hardware:
    • VD56G3 promodules (CAM-56G3)
    • VD56G3 S-Board (STEVAL-56G3MAI)
    • EVK Main (STEVAL-EVK-U0I)
  • Compatible software tools:
    • PC Evaluation software: STSW-IMG501
    • PC Software Development Kit (SDK): STSW-IMG507_56G3
    • Embedded platform drivers: STSW-IMG502
Coming Soon
Operating Temp Min Celsius-30.0
Operating Temp Max Celsius85.0
ECCN USEAR99
ECCN EUNEC
Package Size6.2 x 6.9
Packing TypeTray
RoHs compliantEcopack2
GradeIndustrial
Package NameOBGA

The VD56G3 and VB56G3 are 1.5-megapixel monochrome CMOS image sensors that deliver exceptional imaging performance in a compact form factor. Built on STMicroelectronics' proprietary technologies, including BSI and full CDTI, they achieve superior QE (quantum efficiency), MTF (modulation transfer...
Read More

Key features
  • Resolution: 1.53 MP (1124 x 1364)
  • Chroma: Monochrome
  • Optical format: 1/4’’ (4.61 mm)
  • State-of-the-art pixel technology:
    • Pixel pitch: 2.61 µm
    • Shutter type: Global shutter
    • Technologies: GS (global shutter), BSI (backside illumination), CDTI (continuous digital time integration), and 3D stacking (three-dimensional stacking).
  • Embedded features:
    • Image quality optimization: Autoexposure, defective pixel correction, binning, and more.
    • Data and frame rate optimization: Cropping, subsampling, and more.
    • Others: Context management, temperature sensor, and more.
  • Interfaces:
    • Output: MIPI CSI-2 (1 or 2 lanes) with RAW8 and RAW10 output formats
    • Control: I²C
  • Comprehensive evaluation hardware:
    • VD56G3 promodules (CAM-56G3)
    • VD56G3 S-Board (STEVAL-56G3MAI)
    • EVK Main (STEVAL-EVK-U0I)
  • Compatible software tools:
    • PC Evaluation software: STSW-IMG501
    • PC Software Development Kit (SDK): STSW-IMG507_56G3
    • Embedded platform drivers: STSW-IMG502