VD1943CE/RW

Feature-rich 5-megapixel RGB-IR CMOS image sensor with hybrid shutter and on-chip RGB-IR intelligence

Parameters

Operating Temp Min Celsius	-30.0
Operating Temp Max Celsius	85.0
ECCN US	EAR99
ECCN EU	NEC
Packing Type	Tape Mounted
RoHs compliant	N/A
Grade	Industrial
Package Name	DIE

Description

The VB1943 and VD1943 are 5.1 megapixel, 2.25 µm global, and rolling shutter image sensors. They are designed for a wide spectrum of applications that require capturing color and NIR images. Operation of these sensors combines global and rolling shutter technology with an extended dynamic...
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Key features

Key features
Resolution: 5.1 megapixel sensor (2560 x 1984) Chroma: RGB-NIR, NIR or Bayer Optical format: 1/2.5 inch Image array size: 5.8 mm x 4.5 mm Pixel technology: 3D stacked sensor with 2.25 μm x 2.25 μm BSI pixel size Global and rolling shutter technology Functions: Dual and single exposure modes with separated controls of RGB pixels and NIR pixels Automatic/external synchronization mode Independent horizontal and vertical image flip Automatic dark calibration Dynamic defective pixel correction Integrated noise reduction feature Advanced image processing: Embedded 18-bit high dynamic range pixel reconstruction Embedded Bayer reconstruction with NIR depollution Embedded NIR smart upscale to full resolution monochrome output Four programmable contexts with versatile sequencing management Frame rates: Up to 100 frames per second at full resolution in global shutter mode Up to 50 frames per second at full resolution in rolling shutter mode Interfaces: MIPI CSI-2 interface (dual/quad lanes, max. 1.5 Gbps/lane) MIPI CCI control interface up to 1 MHz 4 programmable GPIOs (general-purpose input/output) to control external illuminators: Output is synchronized with sensor integration periods PWM (pulse-width modulation) control Additional features: Integrated temperature sensor Package options: Available as bare die Available in OBGA package OBGA package: Package size: 10.3 x 8.9 mm Ball matrix: 10 x 9 balls, pitch 0.8 mm

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Parameters

Operating Temp Min Celsius	-30.0
Operating Temp Max Celsius	85.0
ECCN US	EAR99
ECCN EU	NEC
Packing Type	Tape Mounted
RoHs compliant	N/A
Grade	Industrial
Package Name	DIE

Description

Key features

Key features
Resolution: 5.1 megapixel sensor (2560 x 1984) Chroma: RGB-NIR, NIR or Bayer Optical format: 1/2.5 inch Image array size: 5.8 mm x 4.5 mm Pixel technology: 3D stacked sensor with 2.25 μm x 2.25 μm BSI pixel size Global and rolling shutter technology Functions: Dual and single exposure modes with separated controls of RGB pixels and NIR pixels Automatic/external synchronization mode Independent horizontal and vertical image flip Automatic dark calibration Dynamic defective pixel correction Integrated noise reduction feature Advanced image processing: Embedded 18-bit high dynamic range pixel reconstruction Embedded Bayer reconstruction with NIR depollution Embedded NIR smart upscale to full resolution monochrome output Four programmable contexts with versatile sequencing management Frame rates: Up to 100 frames per second at full resolution in global shutter mode Up to 50 frames per second at full resolution in rolling shutter mode Interfaces: MIPI CSI-2 interface (dual/quad lanes, max. 1.5 Gbps/lane) MIPI CCI control interface up to 1 MHz 4 programmable GPIOs (general-purpose input/output) to control external illuminators: Output is synchronized with sensor integration periods PWM (pulse-width modulation) control Additional features: Integrated temperature sensor Package options: Available as bare die Available in OBGA package OBGA package: Package size: 10.3 x 8.9 mm Ball matrix: 10 x 9 balls, pitch 0.8 mm