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    X-NUCLEO-IKS4A1

    Motion MEMS and environmental sensor expansion board for STM32 Nucleo

    Parameters
    Target ApplicationUltrasound imaging
    Core ProductLPS22DFTR, LIS2DUXS12TR, LSM6DSV16XTR, LIS2MDLTR, LSM6DSO16ISTR
    ECCN USEAR99
    ECCN EUNEC
    Packing TypeNot Applicable
    RoHs compliantEcopack2
    GradeIndustrial
    Package NameCARD
    Description

    The X-NUCLEO-IKS4A1 is a motion MEMS and environmental sensor evaluation board kit consisting of the main board X-NUCLEO-IQS4A1, which hosts the motion MEMS and environmental sensors, and the detachable add-on board STEVAL-MKE001A, which hosts the Qvar swipe electrodes.This expansion board allows...
    Read More

    Key features
    Key features
    • Wide range of motion and environmental sensors:
      • LSM6DSO16IS: MEMS 3D accelerometer (±2/±4/±8/±16 g) + 3D gyroscope (±125/±250/±500/±1000/±2000 dps) with ISPU (Intelligent Processing Unit)
      • LIS2MDL: MEMS 3D magnetometer (±50 gauss)
      • LIS2DUXS12: Ultra low-power MEMS 3D accelerometer (±2/±4/±8/±16 g) with Qvar, AI, & anti-aliasing
      • LPS22DF: Low-power and high-precision MEMS pressure sensor, 260-1260 hPa absolute digital output barometer
      • SHT40AD1B: High-accuracy, ultra-low-power relative humidity and temperature sensor (by Sensirion)
      • STTS22H: Low-voltage, ultralow-power, 0.5 °C accuracy temperature sensor (–40 °C to +125 °C)
      • LSM6DSV16X: MEMS 3D accelerometer (±2/±4/±8/±16 g) + 3D gyroscope (±125/±250/±500/±1000/±2000/±4000 dps) with embedded sensor fusion, AI, Qvar
    • LSM6DSV16X: MEMS 3D accelerometer (±2/±4/±8/±16 g) + 3D gyroscope (±125/±250/±500/±1000/±2000/±4000 dps) with embedded sensor fusion, AI, Qvar
    • DIL 24-pin socket available for additional MEMS adapters and other sensors
    • Compatible with X-CUBE-MEMS1, an expansion software package for STM32Cube
    • Equipped with Qvar touch/swipe electrode
    • I²C sensor hub features on LSM6DSO16IS and LSM6DSV16X available
    • Supported by MEMS-Studio, a software solution for MEMS sensors with graphical no-code design of algorithms and development of embedded AI features
    • MIPI I3C® compatibility for communication with LIS2DUXS12, LSM6DSV16X and LPS22DF
    • Compatible with STM32 Nucleo boards
    • Equipped with Arduino UNO R3 connector
    • Equipped with industrial connector for IR sensor (STHS34PF80) application development. It can be connected at the same time of external MEMS through DIL24 adapter
    • Available interface for external camera module applications coupled with LSM6DSV16X through aux SPI (3/4 w)
    • RoHS compliant
    • WEEE compliant
    • UKCA compliant
    In stock
    Quantity $ per unit Savings
    1-2$34.270%
    2 + Contact sales
    $34.27
    $34.27
    Parameters
    Target ApplicationUltrasound imaging
    Core ProductLPS22DFTR, LIS2DUXS12TR, LSM6DSV16XTR, LIS2MDLTR, LSM6DSO16ISTR
    ECCN USEAR99
    ECCN EUNEC
    Packing TypeNot Applicable
    RoHs compliantEcopack2
    GradeIndustrial
    Package NameCARD
    Description

    The X-NUCLEO-IKS4A1 is a motion MEMS and environmental sensor evaluation board kit consisting of the main board X-NUCLEO-IQS4A1, which hosts the motion MEMS and environmental sensors, and the detachable add-on board STEVAL-MKE001A, which hosts the Qvar swipe electrodes.This expansion board allows...
    Read More

    Key features
    Key features
    • Wide range of motion and environmental sensors:
      • LSM6DSO16IS: MEMS 3D accelerometer (±2/±4/±8/±16 g) + 3D gyroscope (±125/±250/±500/±1000/±2000 dps) with ISPU (Intelligent Processing Unit)
      • LIS2MDL: MEMS 3D magnetometer (±50 gauss)
      • LIS2DUXS12: Ultra low-power MEMS 3D accelerometer (±2/±4/±8/±16 g) with Qvar, AI, & anti-aliasing
      • LPS22DF: Low-power and high-precision MEMS pressure sensor, 260-1260 hPa absolute digital output barometer
      • SHT40AD1B: High-accuracy, ultra-low-power relative humidity and temperature sensor (by Sensirion)
      • STTS22H: Low-voltage, ultralow-power, 0.5 °C accuracy temperature sensor (–40 °C to +125 °C)
      • LSM6DSV16X: MEMS 3D accelerometer (±2/±4/±8/±16 g) + 3D gyroscope (±125/±250/±500/±1000/±2000/±4000 dps) with embedded sensor fusion, AI, Qvar
    • LSM6DSV16X: MEMS 3D accelerometer (±2/±4/±8/±16 g) + 3D gyroscope (±125/±250/±500/±1000/±2000/±4000 dps) with embedded sensor fusion, AI, Qvar
    • DIL 24-pin socket available for additional MEMS adapters and other sensors
    • Compatible with X-CUBE-MEMS1, an expansion software package for STM32Cube
    • Equipped with Qvar touch/swipe electrode
    • I²C sensor hub features on LSM6DSO16IS and LSM6DSV16X available
    • Supported by MEMS-Studio, a software solution for MEMS sensors with graphical no-code design of algorithms and development of embedded AI features
    • MIPI I3C® compatibility for communication with LIS2DUXS12, LSM6DSV16X and LPS22DF
    • Compatible with STM32 Nucleo boards
    • Equipped with Arduino UNO R3 connector
    • Equipped with industrial connector for IR sensor (STHS34PF80) application development. It can be connected at the same time of external MEMS through DIL24 adapter
    • Available interface for external camera module applications coupled with LSM6DSV16X through aux SPI (3/4 w)
    • RoHS compliant
    • WEEE compliant
    • UKCA compliant
    Associated products