ACEPACK 2 power module, 3-level topology, 1200 V, 100 A based on SiC Power MOSFET

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Parameter NameParameter Value
Package Size62.8 x 56.7
Packing TypeTray
RoHs compliantEcopack1
Package NameACEPACK 2

This ACEPACK 2 power module represents a leg of a T-type 3-level inverter topology that integrates the advanced silicon carbide power MOSFET technology from STMicroelectronics. This module is manufactured using both the innovative properties of the wide bandgap materials and the high thermal performance substrate, which results in exceptional low on-resistance per unit area and excellent switching performance almost independent of temperature. A negative temperature sensor and three DC link capacitors are also included to optimize switching behavior.

Key features
  • ACEPACK 2 power module
    • 13 mΩ of typical RDS(on) each switch (2 dice in parallel per switch)
    • 2.5 kVrms insulation voltage
    • Integrated NTC temperature sensor
    • DC link capacitors between DC BUS and neutral
    • AIN DBC improved thermal performance
    • Press fit contact pins