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A2U12M12W2-F1C

ACEPACK 2 power module, 3-level topology, 1200 V, 100 A based on SiC Power MOSFET

ECCN USEAR99
ECCN EUNEC
Package Size62.8 x 56.7
Packing TypeTray
RoHs compliantEcopack1
GradeIndustrial
Package NameACEPACK 2

This ACEPACK 2 power module represents a leg of a T-type 3-level inverter topology that integrates the advanced silicon carbide power MOSFET technology from STMicroelectronics. This module is manufactured using both the innovative properties of the wide bandgap materials and the high thermal...
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Key features
  • ACEPACK 2 power module
    • 13 mΩ of typical RDS(on) each switch (2 dice in parallel per switch)
    • 2.5 kVrms insulation voltage
    • Integrated NTC temperature sensor
    • DC link capacitors between DC BUS and neutral
    • AIN DBC improved thermal performance
    • Press fit contact pins
Out of Stock
Quantity $ per unit Savings
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ECCN USEAR99
ECCN EUNEC
Package Size62.8 x 56.7
Packing TypeTray
RoHs compliantEcopack1
GradeIndustrial
Package NameACEPACK 2

This ACEPACK 2 power module represents a leg of a T-type 3-level inverter topology that integrates the advanced silicon carbide power MOSFET technology from STMicroelectronics. This module is manufactured using both the innovative properties of the wide bandgap materials and the high thermal...
Read More

Key features
  • ACEPACK 2 power module
    • 13 mΩ of typical RDS(on) each switch (2 dice in parallel per switch)
    • 2.5 kVrms insulation voltage
    • Integrated NTC temperature sensor
    • DC link capacitors between DC BUS and neutral
    • AIN DBC improved thermal performance
    • Press fit contact pins