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ACEPACK 2 power module, 3-level topology, 1200 V, 100 A based on SiC Power MOSFET
ECCN US | EAR99 |
ECCN EU | NEC |
Package Size | 62.8 x 56.7 |
Packing Type | Tray |
RoHs compliant | Ecopack1 |
Grade | Industrial |
Package Name | ACEPACK 2 |
This ACEPACK 2 power module represents a leg of a T-type 3-level inverter topology that integrates the advanced silicon carbide power MOSFET technology from STMicroelectronics. This module is manufactured using both the innovative properties of the wide bandgap materials and the high thermal...
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ECCN US | EAR99 |
ECCN EU | NEC |
Package Size | 62.8 x 56.7 |
Packing Type | Tray |
RoHs compliant | Ecopack1 |
Grade | Industrial |
Package Name | ACEPACK 2 |
This ACEPACK 2 power module represents a leg of a T-type 3-level inverter topology that integrates the advanced silicon carbide power MOSFET technology from STMicroelectronics. This module is manufactured using both the innovative properties of the wide bandgap materials and the high thermal...
Read More
|