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    A2U12M12W2-F2

    ACEPACK 2 power module, 3-level topology, 1200 V, 13 mOhm typ. SiC Power MOSFET gen.2 with NTC

    Parameters
    ECCN USEAR99
    ECCN EUNEC
    Package Size62.8 x 56.7
    Packing TypeTray
    RoHs compliantEcopack1
    GradeIndustrial
    Package NameACEPACK 2
    Description

    This ACEPACK 2 power module represents a leg of a T-type 3-level inverter topology that integrates the advanced silicon carbide Power MOSFET technology from STMicroelectronics. This module leverages the innovative properties of the wide-bandgap SiC material and a high-thermal-performance substrate....
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    Key features
    Key features
    • 3-level topology
    • ACEPACK 2 power module
      • 13 mΩ of typical RDS(on) each switch
      • Insulation voltage UL certified of 2.5 kVrms
      • Integrated NTC temperature sensor
      • DBC Cu-Al2O3-Cu based
      • Press fit contact pins
    In stock
    Quantity $ per unit Savings
    1$183.750%
    1 + Contact sales
    $183.75
    $183.75
    Parameters
    ECCN USEAR99
    ECCN EUNEC
    Package Size62.8 x 56.7
    Packing TypeTray
    RoHs compliantEcopack1
    GradeIndustrial
    Package NameACEPACK 2
    Description

    This ACEPACK 2 power module represents a leg of a T-type 3-level inverter topology that integrates the advanced silicon carbide Power MOSFET technology from STMicroelectronics. This module leverages the innovative properties of the wide-bandgap SiC material and a high-thermal-performance substrate....
    Read More

    Key features
    Key features
    • 3-level topology
    • ACEPACK 2 power module
      • 13 mΩ of typical RDS(on) each switch
      • Insulation voltage UL certified of 2.5 kVrms
      • Integrated NTC temperature sensor
      • DBC Cu-Al2O3-Cu based
      • Press fit contact pins