B-L475E-IOT01A2

STM32L4 Discovery kit IoT node, low-power wireless, BLE, NFC, SubGHz, Wi-Fi

Parameters

Core Product	STM32L475VG
ECCN US	5A992.c
ECCN EU	NEC
Packing Type	Not Applicable
RoHs compliant	Ecopack1
Grade	Industrial
Package Name	CARD

Description

The B-L475E-IOT01A Discovery kit for IoT node allows users to develop applications with direct connection to cloud servers.The Discovery kit enables a wide diversity of applications by exploiting low-power communication, multiway sensing and Arm® Cortex® -M4 core-based STM32L4 Series features.The...
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Key features

Key features
Ultra-low-power STM32L4 Series MCUs based on Arm^® Cortex^®-M4 core with 1 Mbyte of Flash memory and 128 Kbytes of SRAM, in LQFP100 package 64-Mbit Quad-SPI (Macronix) Flash memory Bluetooth^® V4.1 module (SPBTLE-RF) Sub-GHz (868 MHz or 915 MHz) low-power-programmable RF module (SPSGRF-868 or SPSGRF-915) 802.11 b/g/n compliant Wi-Fi^® module from Inventek Systems (ISM43362-M3G-L44) Dynamic NFC tag based on M24SR with its printed NFC antenna 2 digital omnidirectional microphones (MP34DT01) Capacitive digital sensor for relative humidity and temperature (HTS221) High-performance 3-axis magnetometer (LIS3MDL) 3D accelerometer and 3D gyroscope (LSM6DSL) 260-1260 hPa absolute digital output barometer (LPS22HB) Time-of-Flight and gesture-detection sensor (VL53L0X) 2 push-buttons (user and reset) USB OTG FS with Micro-AB connector Expansion connectors: Arduino™ Uno V3 PMOD Flexible power-supply options: ST LINK USB V_BUS or external sources On-board ST-LINK/V2-1 debugger/programmer with USB re-enumeration capability: mass storage, Virtual COM port and debug port Comprehensive free software HAL library including a variety of examples, as part of the STM32Cube MCU Package Support of a wide choice of Integrated Development Environments (IDEs) including IAR^™, Keil^®, GCC-based IDEs, Arm^® Mbed Enabled^™ Arm^® Mbed^™ online (see http://mbed.org)

In stock

Quantity	$ per unit	Savings
1-2	$53.19	0%
2 +	Contact sales

$53.19

$53.18

Parameters

Core Product	STM32L475VG
ECCN US	5A992.c
ECCN EU	NEC
Packing Type	Not Applicable
RoHs compliant	Ecopack1
Grade	Industrial
Package Name	CARD

Description

Key features

Key features
Ultra-low-power STM32L4 Series MCUs based on Arm^® Cortex^®-M4 core with 1 Mbyte of Flash memory and 128 Kbytes of SRAM, in LQFP100 package 64-Mbit Quad-SPI (Macronix) Flash memory Bluetooth^® V4.1 module (SPBTLE-RF) Sub-GHz (868 MHz or 915 MHz) low-power-programmable RF module (SPSGRF-868 or SPSGRF-915) 802.11 b/g/n compliant Wi-Fi^® module from Inventek Systems (ISM43362-M3G-L44) Dynamic NFC tag based on M24SR with its printed NFC antenna 2 digital omnidirectional microphones (MP34DT01) Capacitive digital sensor for relative humidity and temperature (HTS221) High-performance 3-axis magnetometer (LIS3MDL) 3D accelerometer and 3D gyroscope (LSM6DSL) 260-1260 hPa absolute digital output barometer (LPS22HB) Time-of-Flight and gesture-detection sensor (VL53L0X) 2 push-buttons (user and reset) USB OTG FS with Micro-AB connector Expansion connectors: Arduino™ Uno V3 PMOD Flexible power-supply options: ST LINK USB V_BUS or external sources On-board ST-LINK/V2-1 debugger/programmer with USB re-enumeration capability: mass storage, Virtual COM port and debug port Comprehensive free software HAL library including a variety of examples, as part of the STM32Cube MCU Package Support of a wide choice of Integrated Development Environments (IDEs) including IAR^™, Keil^®, GCC-based IDEs, Arm^® Mbed Enabled^™ Arm^® Mbed^™ online (see http://mbed.org)