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BALF-NRF01D3

50 Ω nominal input / conjugate match balun to nRF51822-QFAAG0,\rnRF51822-QFAB0, nRF51422-QFAAE0 / integrated harmonic filter

Operating Temp Min Celsius-40.0
Operating Temp Max Celsius105.0
ECCN USEAR99
ECCN EUNEC
Packing TypeTape And Reel
RoHs compliantEcopack2
GradeIndustrial
Package NameChip Scale Package 0.4mm pitch

STMicroelectronics BALF-NRF01D3 is an ultraminiature balun. The BALF-NRF01D3 integrates matching network in a monolithic glass substrate. Matching impedance has been customized for the nRF51822-QFAA/QFAB, and nRF51422-QFAA/QFAB RF transceivers.The BALF-NRF01D3 uses STMicroelectronics IPD technology...
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Key features
  • Low insertion loss
  • Low amplitude imbalance
  • Low phase imbalance
  • Coated Flip-Chip on Glass
  • Small footprint: < 1.5 mm2
  • Benefits
    • Very low profile: < 560 μm after reflow
    • High RF performance
    • PCB space saving versus discrete solution
    • BOM count reduction
    • Efficient manufacturability
In stock
Quantity $ per unit Savings
1-9$0.560%
10-99$0.3242%
100-200$0.3047%
Contact sales
$0.56
$0.56
Operating Temp Min Celsius-40.0
Operating Temp Max Celsius105.0
ECCN USEAR99
ECCN EUNEC
Packing TypeTape And Reel
RoHs compliantEcopack2
GradeIndustrial
Package NameChip Scale Package 0.4mm pitch

STMicroelectronics BALF-NRF01D3 is an ultraminiature balun. The BALF-NRF01D3 integrates matching network in a monolithic glass substrate. Matching impedance has been customized for the nRF51822-QFAA/QFAB, and nRF51422-QFAA/QFAB RF transceivers.The BALF-NRF01D3 uses STMicroelectronics IPD technology...
Read More

Key features
  • Low insertion loss
  • Low amplitude imbalance
  • Low phase imbalance
  • Coated Flip-Chip on Glass
  • Small footprint: < 1.5 mm2
  • Benefits
    • Very low profile: < 560 μm after reflow
    • High RF performance
    • PCB space saving versus discrete solution
    • BOM count reduction
    • Efficient manufacturability