BALFHB-WL-01D3

Integrated filter matched balun to BGA STM32WL in high power mode, 862-928 MHz, using 4 layer PCB

Parameters

Operating Temp Min Celsius	-40.0
Operating Temp Max Celsius	105.0
ECCN US	EAR99
ECCN EU	NEC
Packing Type	Tape And Reel
RoHs compliant	Ecopack2
Grade	Industrial
Package Name	Chip Scale Package 0.4mm pitch

Description

STMicroelectronics BALFHB-WL-01D3 is an ultra-miniature balun. This device integrates a matching network, balun, and harmonics filter. Matching impedance has been customized for the STM32WL sub-GHz wireless microcontrollers.It is using STMicroelectronics IPD technology on a nonconductive glass...
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Key features

Key features
BGA STM32WL sub-GHz wireless microcontrollers impedance matched balun and Tx harmonics filter Optimized for BGA STM32WL sub-GHz wireless microcontrollers in high power mode and dedicated to 4-layer PCB 50 Ω nominal input / conjugate matched balun to BGA STM32WL 50 Ω nominal impedance on antenna side Tx and Rx Deep Tx rejection harmonic filter Low insertion loss Small footprint Low profile ≤ 630 μm after reflow High RF performance RF BOM and area reduction ECOPACK2 compliant component

In stock

Quantity	$ per unit	Savings
1-9	$0.74	1%
10-50	$0.66	11%
50 +	Contact sales

$0.74

Parameters

Operating Temp Min Celsius	-40.0
Operating Temp Max Celsius	105.0
ECCN US	EAR99
ECCN EU	NEC
Packing Type	Tape And Reel
RoHs compliant	Ecopack2
Grade	Industrial
Package Name	Chip Scale Package 0.4mm pitch

Description

Key features

Key features
BGA STM32WL sub-GHz wireless microcontrollers impedance matched balun and Tx harmonics filter Optimized for BGA STM32WL sub-GHz wireless microcontrollers in high power mode and dedicated to 4-layer PCB 50 Ω nominal input / conjugate matched balun to BGA STM32WL 50 Ω nominal impedance on antenna side Tx and Rx Deep Tx rejection harmonic filter Low insertion loss Small footprint Low profile ≤ 630 μm after reflow High RF performance RF BOM and area reduction ECOPACK2 compliant component