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NRND

EMIF02-MIC03F2

2-line EMI filter and ESD protection for microphones

ECCN USEAR99
ECCN EUNEC
Package Size1.47 x 1.07 x 0.65
Packing TypeTape And Reel
RoHs compliantEcopack2
GradeIndustrial
Package NameCSP P 0.5 mm

The EMIF02-MIC03F2 is a highly integrated device designed to suppress EMI/RFI noise in all systems subjected to electromagnetic interferences. The EMIF02 Flip-Chip packaging means the package size is equal to the die size.This filter includes an ESD protection circuitry which prevents damage to the...
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Key features
  • EMI symmetrical (I/O) low-pass filter
  • High efficiency in EMI filtering
  • Very low PCB space consuming:1.07 mm x 1.47 mm
  • Very thin package: 0.65 mm
  • High efficiency in ESD suppression
  • High reliability offered by monolithic integration
  • High reducing of parasitic elements through integration and wafer level packaging
  • Complies with the following standards:
    • IEC 61000-4-2 level 4, on input pins
      • 15 kV (air discharge)
      • 8 kV (contact discharge)
    • IEC 61000-4-2 Level 1, on output pins
      • 2 kV (air discharge)
      • 2 kV (contact discharge)
    • MIL STD 883E - Method 3015-6 Class 3
In stock
Quantity $ per unit Savings
1-9$0.341%
10-24$0.333%
25-99$0.319%
100-249$0.2914%
250-499$0.2428%
500$0.1944%
Contact sales
$0.34
$0.34
ECCN USEAR99
ECCN EUNEC
Package Size1.47 x 1.07 x 0.65
Packing TypeTape And Reel
RoHs compliantEcopack2
GradeIndustrial
Package NameCSP P 0.5 mm

The EMIF02-MIC03F2 is a highly integrated device designed to suppress EMI/RFI noise in all systems subjected to electromagnetic interferences. The EMIF02 Flip-Chip packaging means the package size is equal to the die size.This filter includes an ESD protection circuitry which prevents damage to the...
Read More

Key features
  • EMI symmetrical (I/O) low-pass filter
  • High efficiency in EMI filtering
  • Very low PCB space consuming:1.07 mm x 1.47 mm
  • Very thin package: 0.65 mm
  • High efficiency in ESD suppression
  • High reliability offered by monolithic integration
  • High reducing of parasitic elements through integration and wafer level packaging
  • Complies with the following standards:
    • IEC 61000-4-2 level 4, on input pins
      • 15 kV (air discharge)
      • 8 kV (contact discharge)
    • IEC 61000-4-2 Level 1, on output pins
      • 2 kV (air discharge)
      • 2 kV (contact discharge)
    • MIL STD 883E - Method 3015-6 Class 3