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EMIF02-USB01F2

2-line EMI filter and ESD protection with R pull-up for USB interfaces

ECCN USEAR99
ECCN EUNEC
Package Size1.97 x 1.27 x 0.65
Packing TypeTape And Reel
RoHs compliantEcopack2
GradeIndustrial
Package NameCSP P 0.5 mm

The EMIF02-USB01F2 is a highly integrated array designed to suppress EMI / RFI noise for USB port filtering. The EMIF02-USB01F2 Flip-Chip packaging means the package size is equal to the die size.Additionally, this filter includes ESD protection circuitry which prevents damage to the protected...
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Key features
  • High reliability offered by monolithic integration
  • High efficiency in ESD suppression (IEC 61000-4-2 level 4)
  • Complies with the following standards IEC 61000-4-2 level 4 ±15 kV (air discharge) ±8 kV (contact discharge)
  • 2-line low-pass filter + ESD protection
  • Lead-free package
  • High efficiency in EMI filtering
  • Very thin package: 0.65 mm
  • High reduction of parasitic elements through integration and wafer level packaging
  • Very low PCB space occupation: < 2.5 mm2
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10-24$0.565%
25-49$0.548%
50-99$0.4425%
100-249$0.4033%
250-499$0.3639%
500$0.3442%
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$0.59
ECCN USEAR99
ECCN EUNEC
Package Size1.97 x 1.27 x 0.65
Packing TypeTape And Reel
RoHs compliantEcopack2
GradeIndustrial
Package NameCSP P 0.5 mm

The EMIF02-USB01F2 is a highly integrated array designed to suppress EMI / RFI noise for USB port filtering. The EMIF02-USB01F2 Flip-Chip packaging means the package size is equal to the die size.Additionally, this filter includes ESD protection circuitry which prevents damage to the protected...
Read More

Key features
  • High reliability offered by monolithic integration
  • High efficiency in ESD suppression (IEC 61000-4-2 level 4)
  • Complies with the following standards IEC 61000-4-2 level 4 ±15 kV (air discharge) ±8 kV (contact discharge)
  • 2-line low-pass filter + ESD protection
  • Lead-free package
  • High efficiency in EMI filtering
  • Very thin package: 0.65 mm
  • High reduction of parasitic elements through integration and wafer level packaging
  • Very low PCB space occupation: < 2.5 mm2