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EMIF03-SIM02M8

3-line EMI filter and ESD protection for SIM card interfaces

ECCN USEAR99
ECCN EUNEC
Package Size1.70 x 1.50 x 0.55
Packing TypeTape And Reel
RoHs compliantEcopack2
GradeIndustrial
Package NameQFN-8L

The EMIF03-SIM02M8 is a 3 line highly integrated device designed to suppress EMI/RFI noise in all systems exposed to electromagnetic interference.This filter includes ESD protection circuitry, which prevents damage to the application when subjected to ESD surges up to 15 kV on the external...
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Key features
  • SIM card EMI low-pass filter
  • High efficiency in EMI filtering
  • Very low PCB space consuming: 1.7 mm x 1.5 mm
  • Very thin package: 0.6 mm max.
  • High efficiency in ESD suppression on external pins (IEC 61000-4-2 level 4)
  • High reliability offered by monolithic integration
  • High reduction of parasitic elements through integration and wafer level packaging
  • Lead free package
  • Easy layout and flexibility thanks to I/O topology
  • Low clamping voltage
  • Complies with following standards:
    • IEC 61000-4-2 level 4 externals pins 15 kV (air discharge) 8 kV (contact discharge)
    • IEC 61000-4-2 level 2 internal pins 2 kV (air discharge) 2 kV (contact discharge)
  • MIL STD 883G - Method 3015-7 Class 3A (all pins)
In stock
Quantity $ per unit Savings
1-9$0.550%
10-24$0.534%
25-49$0.517%
50-99$0.4224%
100-249$0.3832%
250-499$0.3438%
500$0.3241%
Contact sales
$0.55
$0.55
or
ECCN USEAR99
ECCN EUNEC
Package Size1.70 x 1.50 x 0.55
Packing TypeTape And Reel
RoHs compliantEcopack2
GradeIndustrial
Package NameQFN-8L

The EMIF03-SIM02M8 is a 3 line highly integrated device designed to suppress EMI/RFI noise in all systems exposed to electromagnetic interference.This filter includes ESD protection circuitry, which prevents damage to the application when subjected to ESD surges up to 15 kV on the external...
Read More

Key features
  • SIM card EMI low-pass filter
  • High efficiency in EMI filtering
  • Very low PCB space consuming: 1.7 mm x 1.5 mm
  • Very thin package: 0.6 mm max.
  • High efficiency in ESD suppression on external pins (IEC 61000-4-2 level 4)
  • High reliability offered by monolithic integration
  • High reduction of parasitic elements through integration and wafer level packaging
  • Lead free package
  • Easy layout and flexibility thanks to I/O topology
  • Low clamping voltage
  • Complies with following standards:
    • IEC 61000-4-2 level 4 externals pins 15 kV (air discharge) 8 kV (contact discharge)
    • IEC 61000-4-2 level 2 internal pins 2 kV (air discharge) 2 kV (contact discharge)
  • MIL STD 883G - Method 3015-7 Class 3A (all pins)