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    EMIF06-1005MX12Y

    Automotive grade 6-line low capacitance EMI filter and ESD protection

    Parameters
    ECCN USEAR99
    ECCN EUNEC
    Package Size3.00 x1.35 x 0.75
    Packing TypeTape And Reel
    RoHs compliantEcopack2
    GradeAutomotive
    Package NameQFN-12L
    Description

    This is a highly integrated 6-line device designed to suppress EMI/RFI noise in all systems exposed to electromagnetic interference.This filter includes ESD protection circuitry, which prevents the application from damages when subjected to ESD surges up to 15 kV on the input...
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    Key features
    Key features
    • AEC-Q101 qualified
    • EMI symmetrical (I/O) low-pass filter
    • High efficiency in EMI filtering: -34 dB at frequencies from 900 MHz to 1.8 GHz
    • Very low PCB space consumption: 3 mm x 1.35 mm
    • Very thin package: 0.8 mm max
    • High efficiency in ESD suppression on input pins (IEC 61000-4-2 level 4)
    • High reliability offered by monolithic integration
    • High reduction of parasitic elements through integration and wafer level packaging
    • Lead-free package
    Out of Stock
    Parameters
    ECCN USEAR99
    ECCN EUNEC
    Package Size3.00 x1.35 x 0.75
    Packing TypeTape And Reel
    RoHs compliantEcopack2
    GradeAutomotive
    Package NameQFN-12L
    Description

    This is a highly integrated 6-line device designed to suppress EMI/RFI noise in all systems exposed to electromagnetic interference.This filter includes ESD protection circuitry, which prevents the application from damages when subjected to ESD surges up to 15 kV on the input...
    Read More

    Key features
    Key features
    • AEC-Q101 qualified
    • EMI symmetrical (I/O) low-pass filter
    • High efficiency in EMI filtering: -34 dB at frequencies from 900 MHz to 1.8 GHz
    • Very low PCB space consumption: 3 mm x 1.35 mm
    • Very thin package: 0.8 mm max
    • High efficiency in ESD suppression on input pins (IEC 61000-4-2 level 4)
    • High reliability offered by monolithic integration
    • High reduction of parasitic elements through integration and wafer level packaging
    • Lead-free package