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HDMI2C4-5F2

ESD protection and signal booster for HDMI source control stage interface

Operating Temp Min Celsius-40.0
Operating Temp Max Celsius85.0
ECCN USEAR99
ECCN EUNEC
Packing TypeTape And Reel
RoHs compliantEcopack2
GradeIndustrial
Package NameCSP P 0.5 mm

The HDMI2C4-5F2 is an integrated ESD protection and signal conditioning device for control links of HDMI™ transmitters (Source).This device is a simple solution that provides HDMI™ designers with an easy and fast way to reach full compliance with the stringent HDMI™ CTS on a wide temperature...
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Key features
  • For HDMI™ 1.4, 2.0 & 2.1 application, operating temperature from -40 to 85 °C
  • 8 kV contact ESD protection on connector side (IEC 61000-4-2 level 4)
  • DDC (I2C) buffers with level shifter and backdrive protection
  • High integration level in 1 package
  • DDC (I2C) link protection, bi-directional signal conditioning circuit and dynamic pull-up
  • HPD pull down, signal conditioning with level shifter and backdrive protection
  • Enable function available for power consumption control and optimization (=ENABLE_IC)
  • 325 mA Short-circuit protection on 5V output with backdrive protection
  • Proposed in 500 µm pitch WLCSP package 12 bumps
In stock
Quantity $ per unit Savings
1-9$0.920%
10-99$0.8013%
100-130$0.5640%
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$0.92
$0.92
Operating Temp Min Celsius-40.0
Operating Temp Max Celsius85.0
ECCN USEAR99
ECCN EUNEC
Packing TypeTape And Reel
RoHs compliantEcopack2
GradeIndustrial
Package NameCSP P 0.5 mm

The HDMI2C4-5F2 is an integrated ESD protection and signal conditioning device for control links of HDMI™ transmitters (Source).This device is a simple solution that provides HDMI™ designers with an easy and fast way to reach full compliance with the stringent HDMI™ CTS on a wide temperature...
Read More

Key features
  • For HDMI™ 1.4, 2.0 & 2.1 application, operating temperature from -40 to 85 °C
  • 8 kV contact ESD protection on connector side (IEC 61000-4-2 level 4)
  • DDC (I2C) buffers with level shifter and backdrive protection
  • High integration level in 1 package
  • DDC (I2C) link protection, bi-directional signal conditioning circuit and dynamic pull-up
  • HPD pull down, signal conditioning with level shifter and backdrive protection
  • Enable function available for power consumption control and optimization (=ENABLE_IC)
  • 325 mA Short-circuit protection on 5V output with backdrive protection
  • Proposed in 500 µm pitch WLCSP package 12 bumps