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    LIS2DU12TR

    Evaluation

    MEMS digital output motion sensor: high-performance, 3-axes accelerometer with small footprint and advanced features
    Learn More about LIS2DU12TR

    Quantity $ per Unit Savings
    1 - 9$2.810%
    10 - 24$2.530%
    25 - 99$2.390%
    100 - 249$2.080%
    250 - 499$1.990%
    500$1.630%
    500 + Contact Sales
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    Parameter NameParameter Value
    Operating Temp Min Celsius-40.0
    Operating Temp Max Celsius85.0
    ECCN USEAR99
    ECCN EUNEC
    Packing TypeTape And Reel
    RoHs compliantEcopack2
    GradeIndustrial
    Package NameLGA 2X2X0.74MAX 12 LEADS

    The LIS2DU12 is an ultra-low-power three-axis linear accelerometer embedding advanced digital functions.


    The LIS2DU12 has user-selectable full scales of ±2g/±4g/±8g/±16g and is capable of measuring accelerations with output data rates from 1.6 Hz to 800 Hz.


    The LIS2DU12 has an integrated 128-level FIFO buffer allowing to store a wide range of data, reducing system power consumption.


    The embedded self-test capability allows the user to check that the sensor works in the final application.


    The LIS2DU12 has a dedicated internal engine to process motion and acceleration detection including free-fall, wake-up, single/double-tap recognition, activity/inactivity, and 6D/4D orientation.


    The LIS2DU12 is available in a small thin plastic land grid array package (LGA) and it is guaranteed to operate over an extended temperature range from -40°C to + 85 °C.

    Key features
    • Supply voltage range from 1.62 to 3.6 V with independent IO supply
    • Ultra-low power consumption
      • Normal mode with anti-alias filter: 5.9 µA
      • Ultra-low-power mode: 0.45 µA
      • One-shot mode: 0.2 µA
      • Power-down: 0.02 µA
    • Low noise down to 160 µg/√Hz
    • ±2g/±4g/±8g/±16g full scales
    • ODR from 1.6 Hz to 800 Hz
    • Embedded temperature sensor
    • Embedded FIFO: up to 512 samples of accelerometer and temperature data in high resolution or up to 768 samples of acceleration data at low resolution
    • High-speed I²C/SPI/MIPI I3CSM digital output interface
    • Embedded digital functions (free-fall, wake-up, single/double-tap recognition, activity/inactivity, 6D/4D orientation)
    • Self-test
    • Small package: 2.0 x 2.0 x 0.74 (max) mm LGA 12-lead
    • 10000 g high shock survivability
    • ECOPACK, RoHS and “Green” compliant