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iNEMO inertial module: 3D accelerometer and 3D gyroscope

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Parameter NameParameter Value
Operating Temp Min Celsius-40.0
Operating Temp Max Celsius85.0
Packing TypeTape And Reel
RoHs compliantEcopack2
Package NameVFLGA2.5X3X.71 14L P.5 L.475X.25

The LSM6DSV16B is a system-in-package inertial measurement unit (IMU) featuring a 3-axis digital accelerometer and a 3-axis digital gyroscope with dual channels for processing acceleration and angular rate sensing data for motion tracking (user interface, device power management, 3D head tracking for gaming and an enhanced audio experience) as well as vibration detection for bone conduction on separate channels with dedicated configuration, processing, and filtering.

The motion tracking in high-performance mode runs at 0.6 mA and enables always-on low-power features for an optimal motion experience.

The LSM6DSV16B embeds advanced dedicated features and data processing for motion processing like the finite state machine (FSM), sensor fusion low power (SFLP), and adaptive self-configuration (ASC).

The LSM6DSV16B integrates a 6-axis IMU sensor with audio accelerometer features in a compact package (2.5 x 3.0 x 0.71 mm).

Key features
  • Dual channels for motion tracking and bone conduction
  • Power consumption: 0.95 mA in combo high-performance mode
  • “Always-on experience with low power consumption for both accelerometer and gyroscope
  • Smart FIFO up to 4.5 KB
  • ±2/±4/±8/±16 g full scale
  • ±125/±250/±500/±1000/±2000/±4000 dps full scale
  • 3-axis audio accelerometer ​with flat and wide bandwidth > 1 kHz ​ and low noise 20 μg /√Hz
  • SPI / I²C & MIPI I3C® v1.1 serial interface with main processor data synchronization
  • TDM slave interface
  • Advanced pedometer, step detector, and step counter
  • Significant motion detection, tilt detection
  • Standard interrupts: free-fall, wakeup, 6D orientation, click and double-click
  • Programmable finite state machine for accelerometer, gyroscope, and external sensor data processing with high rate @ 960 Hz
  • Embedded adaptive self-configuration (ASC)
  • Embedded sensor fusion low-power algorithm
  • Embedded temperature sensor
  • Analog supply voltage: 1.71 V to 3.6 V
  • Independent IO supply (extended range: 1.08 V to 3.6 V)
  • Compact footprint: 2.5 mm x 3 mm x 0.71 mm
  • ECOPACK and RoHS compliant