MLPF-WB-02D3

2.4 GHz Low Pass Filter matched to STM32WB5x and STM32WB1x in WLCSP and UFBGA packages

Parameters

Operating Temp Min Celsius	-40.0
Operating Temp Max Celsius	105.0
ECCN US	EAR99
ECCN EU	NEC
Packing Type	Tape And Reel
RoHs compliant	Ecopack2
Grade	Industrial
Package Name	Chip Scale Package 0.4mm pitch

Description

The MLPF-WB-02D3 integrates an impedance matching network and harmonics filter. The matching impedance network has been tailored to maximize the RF performances of STM32WB5x and STM32WB1x in WLCSP and UFBGA packages. This device uses STMicroelectronics IPD technology on non-conductive glass...
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Key features

Key features
Integrated impedance matching to STM32WB5x and STM32WB1x in WLCSP and UFBGA packages 50 Ω nominal impedance on antenna side Deep rejection harmonics filter Low insertion loss Small footprint Low profile ≤ 630 μm after reflow High RF performances RF BOM and area reduction ECOPACK2 compliant component

In stock

Quantity	$ per unit	Savings
1-9	$0.59	0%
10-99	$0.58	2%
100-249	$0.32	47%
250-499	$0.28	52%
500	$0.28	53%
500 +	Contact sales

$0.59

Parameters

Operating Temp Min Celsius	-40.0
Operating Temp Max Celsius	105.0
ECCN US	EAR99
ECCN EU	NEC
Packing Type	Tape And Reel
RoHs compliant	Ecopack2
Grade	Industrial
Package Name	Chip Scale Package 0.4mm pitch

Description

Key features

Key features
Integrated impedance matching to STM32WB5x and STM32WB1x in WLCSP and UFBGA packages 50 Ω nominal impedance on antenna side Deep rejection harmonics filter Low insertion loss Small footprint Low profile ≤ 630 μm after reflow High RF performances RF BOM and area reduction ECOPACK2 compliant component