MLPF-WB55-01E3

2.4 GHz Matched filter companion chip for STM32WB55Cx and STM32WB55Rx

Parameters

Operating Temp Min Celsius	-40.0
Operating Temp Max Celsius	105.0
ECCN US	EAR99
ECCN EU	NEC
Packing Type	Tape And Reel
RoHs compliant	Ecopack2
Grade	Industrial
Package Name	FLIP CHIP BUMPLESS CSPG

Description

The MLPF-WB55-01E3 integrates an impedance matching network and harmonics filter. The matching impedance network has been tailored to maximize the RF performance of STM32WB. This device uses STMicroelectronics IPD technology on non-conductive glass substrate which optimizes RF performance.

Key features

Key features
Integrated impedance matching to STM32WB55Cx/Rx, STM32WB50Cx, STM32WB35Cx and STM32WB30Cx LGA footprint compatible 50 Ω nominal impedance on antenna side Deep rejection harmonics filter Low insertion loss Small footprint Low thickness ≤ 450 μm High RF performance RF BOM and area reduction ECOPACK2 compliant

In stock

Quantity	$ per unit	Savings
1-9	$0.57	0%
10-99	$0.56	1%
100-249	$0.31	46%
250-400	$0.28	52%
400 +	Contact sales

$0.57

Parameters

Operating Temp Min Celsius	-40.0
Operating Temp Max Celsius	105.0
ECCN US	EAR99
ECCN EU	NEC
Packing Type	Tape And Reel
RoHs compliant	Ecopack2
Grade	Industrial
Package Name	FLIP CHIP BUMPLESS CSPG

Description

Key features

Key features
Integrated impedance matching to STM32WB55Cx/Rx, STM32WB50Cx, STM32WB35Cx and STM32WB30Cx LGA footprint compatible 50 Ω nominal impedance on antenna side Deep rejection harmonics filter Low insertion loss Small footprint Low thickness ≤ 450 μm High RF performance RF BOM and area reduction ECOPACK2 compliant