OIMMA8MBHP01158$

SIM & eSIM system-on-chip solution for secure M2M industrial applications

Parameters

Operating Temp Min Celsius	-40.0
Operating Temp Max Celsius	105.0
ECCN US	3A991.a.2
ECCN EU	NEC
Packing Type	Tape And Reel
RoHs compliant	N/A
Grade	Industrial
Package Name	VFDFPN 8 5X6 WETTABLE FLANK

Description

The ST4SIM-110M is an STMicroelectronics SIM and embedded SIM (eSIM or eUICC) product designed for all industrial devices.The ST4SIM-110M pre-integrates a cellular connectivity configuration provided by trusted partners. In this way, the product is ready to be deployed to the field.The device...
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Key features

Key features
Cellular network connectivity configuration provided by trusted partners Compliant with 2G / 3G / 4G (LTE) / CDMA / NB-IoT / CAT–M networks Network access applications supported: SIM / USIM / ISIM / CSIM Secure element access control (ARF / PKCS#15) OTA capability over SMS, CAT-TP & HTTPS (including DNS) Multi-interfaces able to combine (U)SIM + eSE Hardware Product available on ST33G1M2M ST33 product based on a 32-bit Arm^® SecurCore^® SC300^™ RISC core Supply voltage: Class A (5 V), Class B (3 V), Class C (1.8 V) Asynchronous serial I/O port ISO/IEC 7816-3 compatible (T=0 protocol) Serial peripheral interface (SPI), depending on packages Industrial qualification (JEDEC JESD47) Operating temperature: -40°C to +105°C Common Criteria EAL5+ ECOPACK-compliant packages 2FF, 3FF or 4FF plugin card (based on D16 micromodule) DFN8 with wettable flanks (MFF2) WLCSP11 Security Symmetric cryptography DES / 3DES / AES Asymmetric cryptography RSA (up to 2048 bits) HTTPS remote management TLS v1.0, v1.1 and v1.2 Elliptic curve cryptography (up to 521 bits) including preloaded curve NIST P-256 and brainpool P256r1 Authentication algorithm: Comp128-2/-3, MILENAGE, TUAK, CAVE Software standard compliancy Java^® Card v3.0.4 Classic GlobalPlatform^® card specification v2.2, including GP amendments A, B, C, D and E ETSI, 3GPP and 3GPP2 release 12 (for further information, contact the local STMicroelectronics sales office) Power saving features (PSM and eDRX) defined by ETSI release 13

Out of Stock

Quantity	$ per unit	Savings
1-500	$0.00	0%
500 +	Contact sales

$0.00

Parameters

Operating Temp Min Celsius	-40.0
Operating Temp Max Celsius	105.0
ECCN US	3A991.a.2
ECCN EU	NEC
Packing Type	Tape And Reel
RoHs compliant	N/A
Grade	Industrial
Package Name	VFDFPN 8 5X6 WETTABLE FLANK

Description

Key features

Key features
Cellular network connectivity configuration provided by trusted partners Compliant with 2G / 3G / 4G (LTE) / CDMA / NB-IoT / CAT–M networks Network access applications supported: SIM / USIM / ISIM / CSIM Secure element access control (ARF / PKCS#15) OTA capability over SMS, CAT-TP & HTTPS (including DNS) Multi-interfaces able to combine (U)SIM + eSE Hardware Product available on ST33G1M2M ST33 product based on a 32-bit Arm^® SecurCore^® SC300^™ RISC core Supply voltage: Class A (5 V), Class B (3 V), Class C (1.8 V) Asynchronous serial I/O port ISO/IEC 7816-3 compatible (T=0 protocol) Serial peripheral interface (SPI), depending on packages Industrial qualification (JEDEC JESD47) Operating temperature: -40°C to +105°C Common Criteria EAL5+ ECOPACK-compliant packages 2FF, 3FF or 4FF plugin card (based on D16 micromodule) DFN8 with wettable flanks (MFF2) WLCSP11 Security Symmetric cryptography DES / 3DES / AES Asymmetric cryptography RSA (up to 2048 bits) HTTPS remote management TLS v1.0, v1.1 and v1.2 Elliptic curve cryptography (up to 521 bits) including preloaded curve NIST P-256 and brainpool P256r1 Authentication algorithm: Comp128-2/-3, MILENAGE, TUAK, CAVE Software standard compliancy Java^® Card v3.0.4 Classic GlobalPlatform^® card specification v2.2, including GP amendments A, B, C, D and E ETSI, 3GPP and 3GPP2 release 12 (for further information, contact the local STMicroelectronics sales office) Power saving features (PSM and eDRX) defined by ETSI release 13