SPC56EL60L3CCFQR

32-bit Power Architecture MCU for Automotive Chassis and Safety Applications

Parameters

Supply Voltage Min Volt	3.0
Supply Voltage Max Volt	3.6
Operating Temp Min Celsius	-40.0
Operating Temp Max Celsius	125.0
Core	Dual e200z4d
ECCN US	5A991.b.4.a
ECCN EU	NEC
Packing Type	Tape And Reel
RoHs compliant	Ecopack2
Grade	Automotive Safety
Package Name	LQFP 100 14x14x1.4 mm

Description

The Leopard series microcontrollers are system-on-chip devices that are built on Power Architecture technology and contain enhancements that improve the architecture’s fit in embedded applications, include additional instruction support for digital signal processing (DSP) and integrate...
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Key features

Key features
High-performance e200z4d dual core 32-bit Power Architecture^® technology CPU Core frequency as high as 120 MHz Dual issue five-stage pipeline core Variable Length Encoding (VLE) Memory Management Unit (MMU) 4 KB instruction cache with error detection code Signal processing engine (SPE) Memory available 1 MB flash memory with ECC 128 KB on-chip SRAM with ECC Built-in RWW capabilities for EEPROM emulation SIL3/ASILD innovative safety concept: LockStep mode and Fail-safe protection Sphere of replication (SoR) for key components (such as CPU core, eDMA, crossbar switch) Fault collection and control unit (FCCU) Redundancy control and checker unit (RCCU) on outputs of the SoR connected to FCCU Boot-time Built-In Self-Test for Memory (MBIST) and Logic (LBIST) triggered by hardware Boot-time Built-In Self-Test for ADC and flash memory triggered by software Replicated safety enhanced watchdog Replicated junction temperature sensor Non-maskable interrupt (NMI) 16-region memory protection unit (MPU) Clock monitoring units (CMU) Power management unit (PMU) Cyclic redundancy check (CRC) unit Decoupled Parallel mode for high-performance use of replicated cores Nexus Class 3+ interface Interrupts Replicated 16-priority controller Replicated 16-channel eDMA controller GPIOs individually programmable as input, output or special function Three 6-channel general-purpose eTimer units 2 FlexPWM units Four 16-bit channels per module Communications interfaces 2 LINFlexD channels 3 DSPI channels with automatic chip select generation 2 FlexCAN interfaces (2.0B Active) with 32 message objects FlexRay module (V2.1 Rev. A) with 2 channels, 64 message buffers and data rates up to 10 Mbit/s Two 12-bit analog-to-digital converters (ADCs) 16 input channels Programmable cross triggering unit (CTU) to synchronize ADCs conversion with timer and PWM Sine wave generator (D/A with low pass filter) On-chip CAN/UART bootstrap loader Single 3.0 V to 3.6 V voltage supply Ambient temperature range –40 °C to 125 °C Junction temperature range –40 °C to 150 °C

Out of Stock

Quantity	$ per unit	Savings
1-500	$18.36	0%
500 +	Contact sales

$18.36

Parameters

Supply Voltage Min Volt	3.0
Supply Voltage Max Volt	3.6
Operating Temp Min Celsius	-40.0
Operating Temp Max Celsius	125.0
Core	Dual e200z4d
ECCN US	5A991.b.4.a
ECCN EU	NEC
Packing Type	Tape And Reel
RoHs compliant	Ecopack2
Grade	Automotive Safety
Package Name	LQFP 100 14x14x1.4 mm

Description

Key features

Key features
High-performance e200z4d dual core 32-bit Power Architecture^® technology CPU Core frequency as high as 120 MHz Dual issue five-stage pipeline core Variable Length Encoding (VLE) Memory Management Unit (MMU) 4 KB instruction cache with error detection code Signal processing engine (SPE) Memory available 1 MB flash memory with ECC 128 KB on-chip SRAM with ECC Built-in RWW capabilities for EEPROM emulation SIL3/ASILD innovative safety concept: LockStep mode and Fail-safe protection Sphere of replication (SoR) for key components (such as CPU core, eDMA, crossbar switch) Fault collection and control unit (FCCU) Redundancy control and checker unit (RCCU) on outputs of the SoR connected to FCCU Boot-time Built-In Self-Test for Memory (MBIST) and Logic (LBIST) triggered by hardware Boot-time Built-In Self-Test for ADC and flash memory triggered by software Replicated safety enhanced watchdog Replicated junction temperature sensor Non-maskable interrupt (NMI) 16-region memory protection unit (MPU) Clock monitoring units (CMU) Power management unit (PMU) Cyclic redundancy check (CRC) unit Decoupled Parallel mode for high-performance use of replicated cores Nexus Class 3+ interface Interrupts Replicated 16-priority controller Replicated 16-channel eDMA controller GPIOs individually programmable as input, output or special function Three 6-channel general-purpose eTimer units 2 FlexPWM units Four 16-bit channels per module Communications interfaces 2 LINFlexD channels 3 DSPI channels with automatic chip select generation 2 FlexCAN interfaces (2.0B Active) with 32 message objects FlexRay module (V2.1 Rev. A) with 2 channels, 64 message buffers and data rates up to 10 Mbit/s Two 12-bit analog-to-digital converters (ADCs) 16 input channels Programmable cross triggering unit (CTU) to synchronize ADCs conversion with timer and PWM Sine wave generator (D/A with low pass filter) On-chip CAN/UART bootstrap loader Single 3.0 V to 3.6 V voltage supply Ambient temperature range –40 °C to 125 °C Junction temperature range –40 °C to 150 °C