SPC584B64E3ND00X

32-bit Power Architecture MCU for Automotive General Purpose Applications - Chorus family

Parameters

Supply Voltage Min Volt	3.0
Supply Voltage Max Volt	5.5
Operating Temp Min Celsius	-40.0
Operating Temp Max Celsius	125.0
Core	e200z4d
ECCN US	5A991.b.4.a
ECCN EU	NEC
Packing Type	Tape And Reel
RoHs compliant	Ecopack2
Grade	Automotive Safety
Package Name	TQFP 100 14x14x1.0

Description

Key features

Key features
AEC-Q100 qualified High performance e200z420 32-bit Power Architecture technology CPU Core frequency as high as 120 MHz Variable Length Encoding (VLE) 2112 KB (2048 KB code flash + 64 KB data flash) on-chip flash memory: supports read during program and erase operations, and multiple blocks allowing EEPROM emulation 176 KB HSM dedicated flash memory (144 KB code + 32 KB data) 128 KB on-chip general-purpose SRAM (in addition to 64 KB core local data RAM Crossbar switch architecture for concurrent access to peripherals, Flash, or RAM from multiple bus masters with end-to-end ECC Multi-channel direct memory access controller (eDMA) with 64 channels 1 interrupt controller (INTC) Comprehensive new generation ASIL-B safety concept ASIL-B of ISO 26262 FCCU for collection and reaction to failure notifications Memory Error Management Unit (MEMU) for collection and reporting of error events in memories Cyclic redundancy check (CRC) unit Enhanced low power support Ultra low power STANDBY Smart Wake-up Unit Fast wake-up and execute from RAM Enhanced modular IO subsystem (eMIOS): up to 64 timed I/O channels with 16-bit counter resolution Body cross triggering unit (BCTU) Triggers ADC conversions from any eMIOS channel Triggers ADC conversions from up to 2 dedicated PIT_RTIs Enhanced analog-to-digital converter system with: 2 independent fast 12-bit SAR analog converters 1 supervisor 12-bit SAR analog converter 1 10-bit SAR analog converter with STDBY mode support Communication interfaces 1 Ethernet controller 10/100 Mbps, compliant IEEE 802.3-2008 8 MCAN interfaces with advanced shared memory scheme and ISO CAN-FD support 14 LINFlexD modules 7 Deserial Serial Peripheral Interface (DSPI) modules Dual phase-locked loops with stable clock domain for peripherals and FM modulation domain for computational shell Nexus Development Interface (NDI) per IEEE-ISTO 5001-2003 standard, with some support for 2010 standard Boot Assist Flash (BAF) supports factory programming using a serial bootload through the asynchronous CAN or LIN/UART Junction temperature range -40 °C to 150 °C

Out of Stock

Quantity	$ per unit	Savings
1-9	$17.25	10%
10-24	$15.86	17%
25-99	$15.20	21%
100-249	$13.40	30%
250-499	$12.74	34%
500	$11.92	38%
500 +	Contact sales

Special Price $17.25 Regular Price $19.16

Parameters

Supply Voltage Min Volt	3.0
Supply Voltage Max Volt	5.5
Operating Temp Min Celsius	-40.0
Operating Temp Max Celsius	125.0
Core	e200z4d
ECCN US	5A991.b.4.a
ECCN EU	NEC
Packing Type	Tape And Reel
RoHs compliant	Ecopack2
Grade	Automotive Safety
Package Name	TQFP 100 14x14x1.0

Description

Key features

Key features
AEC-Q100 qualified High performance e200z420 32-bit Power Architecture technology CPU Core frequency as high as 120 MHz Variable Length Encoding (VLE) 2112 KB (2048 KB code flash + 64 KB data flash) on-chip flash memory: supports read during program and erase operations, and multiple blocks allowing EEPROM emulation 176 KB HSM dedicated flash memory (144 KB code + 32 KB data) 128 KB on-chip general-purpose SRAM (in addition to 64 KB core local data RAM Crossbar switch architecture for concurrent access to peripherals, Flash, or RAM from multiple bus masters with end-to-end ECC Multi-channel direct memory access controller (eDMA) with 64 channels 1 interrupt controller (INTC) Comprehensive new generation ASIL-B safety concept ASIL-B of ISO 26262 FCCU for collection and reaction to failure notifications Memory Error Management Unit (MEMU) for collection and reporting of error events in memories Cyclic redundancy check (CRC) unit Enhanced low power support Ultra low power STANDBY Smart Wake-up Unit Fast wake-up and execute from RAM Enhanced modular IO subsystem (eMIOS): up to 64 timed I/O channels with 16-bit counter resolution Body cross triggering unit (BCTU) Triggers ADC conversions from any eMIOS channel Triggers ADC conversions from up to 2 dedicated PIT_RTIs Enhanced analog-to-digital converter system with: 2 independent fast 12-bit SAR analog converters 1 supervisor 12-bit SAR analog converter 1 10-bit SAR analog converter with STDBY mode support Communication interfaces 1 Ethernet controller 10/100 Mbps, compliant IEEE 802.3-2008 8 MCAN interfaces with advanced shared memory scheme and ISO CAN-FD support 14 LINFlexD modules 7 Deserial Serial Peripheral Interface (DSPI) modules Dual phase-locked loops with stable clock domain for peripherals and FM modulation domain for computational shell Nexus Development Interface (NDI) per IEEE-ISTO 5001-2003 standard, with some support for 2010 standard Boot Assist Flash (BAF) supports factory programming using a serial bootload through the asynchronous CAN or LIN/UART Junction temperature range -40 °C to 150 °C