STEVAL-STWINKT1

SensorTile Wireless Industrial Node development kit and reference design for industrial IoT applications

Parameters

Operating Range	Industrial
Target Application	Active 3D glasses
Core Product	IIS3DWB, ISM330DHCX, STM32L4R9ZIJ6
ECCN US	5A992.c
ECCN EU	5A002.a.2
Packing Type	Not Applicable
RoHs compliant	Ecopack2
Grade	Industrial
Package Name	CARD

Description

The STWIN SensorTile wireless industrial node (STEVAL-STWINKT1) is a development kit and reference design that simplifies prototyping and testing of advanced industrial IoT applications such as condition monitoring and predictive maintenance.The kit features a core system board with a range of...
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Key features

Key features
Multi-sensing wireless platform implementing vibration monitoring and ultrasound detection Built around STWIN core system board with processing, sensing, connectivity and expansion capabilities Ultra-low-power ARM Cortex-M4 MCU at 120 MHz with FPU, 2048 kbytes Flash memory (STM32L4R9) Micro SD Card slot for standalone data logging applications Wireless BLE4.2 (on-board) and Wi-Fi (with STEVAL-STWINWFV1 expansion board), and wired RS485 and USB OTG connectivity Option to implement Authentication and Brand protection secure solution with STSAFE-A110 (footprint) Wide range of industrial IoT sensors: ultra-wide bandwidth (up to 6 kHz), low-noise, 3-axis digital vibration sensor (IIS3DWB) 3D accelerometer + 3D Gyro iNEMO inertial measurement unit (ISM330DHCX) with machine learning core ultra-low-power high performance MEMS motion sensor (IIS2DH) ultra-low-power 3-axis magnetometer (IIS2MDC) digital absolute pressure sensor (LPS22HH) relative humidity and temperature sensor (HTS221) low-voltage digital local temperature sensor (STTS751) industrial grade digital MEMS microphone (IMP34DT05) wideband analog MEMS microphone (MP23ABS1) Modular architecture, expandable via on-board connectors: STMOD+ and 40-pin flex general purpose expansions 12-pin male plug for connectivity expansions 12-pin female plug for sensing expansions Other kit components: Li-Po battery 480 mAh STLINK-V3MINI debugger with programming cable Plastic box

In stock

Quantity	$ per unit	Savings
1-2	$98.00	0%
2 +	Contact sales

$98.00

Parameters

Operating Range	Industrial
Target Application	Active 3D glasses
Core Product	IIS3DWB, ISM330DHCX, STM32L4R9ZIJ6
ECCN US	5A992.c
ECCN EU	5A002.a.2
Packing Type	Not Applicable
RoHs compliant	Ecopack2
Grade	Industrial
Package Name	CARD

Description

Key features

Key features
Multi-sensing wireless platform implementing vibration monitoring and ultrasound detection Built around STWIN core system board with processing, sensing, connectivity and expansion capabilities Ultra-low-power ARM Cortex-M4 MCU at 120 MHz with FPU, 2048 kbytes Flash memory (STM32L4R9) Micro SD Card slot for standalone data logging applications Wireless BLE4.2 (on-board) and Wi-Fi (with STEVAL-STWINWFV1 expansion board), and wired RS485 and USB OTG connectivity Option to implement Authentication and Brand protection secure solution with STSAFE-A110 (footprint) Wide range of industrial IoT sensors: ultra-wide bandwidth (up to 6 kHz), low-noise, 3-axis digital vibration sensor (IIS3DWB) 3D accelerometer + 3D Gyro iNEMO inertial measurement unit (ISM330DHCX) with machine learning core ultra-low-power high performance MEMS motion sensor (IIS2DH) ultra-low-power 3-axis magnetometer (IIS2MDC) digital absolute pressure sensor (LPS22HH) relative humidity and temperature sensor (HTS221) low-voltage digital local temperature sensor (STTS751) industrial grade digital MEMS microphone (IMP34DT05) wideband analog MEMS microphone (MP23ABS1) Modular architecture, expandable via on-board connectors: STMOD+ and 40-pin flex general purpose expansions 12-pin male plug for connectivity expansions 12-pin female plug for sensing expansions Other kit components: Li-Po battery 480 mAh STLINK-V3MINI debugger with programming cable Plastic box