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STHVUP64

64 channels ±100 V, ±0.2/0.4 A, 3/5-level RTZ, TR switch, high-speed ultrasound pulser with integrated transmit beamformer

ECCN USEAR99
ECCN EUNEC
Packing TypeTray
RoHs compliantEcopack1 (*)
GradeIndustrial
Package NameFCBGA196 10x10x1.4 0.65P 0.35B

The STHVUP64 is a 64 channels monolithic high-voltage and high-speed pulser with an integrated beamformer. It is specifically designed for pulse generation in multi-channel low-power ultra-portable medical ultrasound applications. The waveforms generated by STHVUP64 are described with...
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Key features
  • Pulsed wave (PW) and continuous wave (CW) mode operations:
    • 3- or 5-level ±100 V output waveform
    • Programmable ±200 mA or ±400 mA source and
      sink current in 3-level configuration (±200 mA in
      5-level configuration)
  • Fully integrated 45 Ω resistance real clamping-to-ground function
  • Fully integrated 45 Ω resistance transmitting/receiving switches (TR_SW)
    • Compliant with receiver multiplexing
      function
  • Auxiliary integrated circuits
    • Noise-blocking diodes
    • Thermal protection
    • Undervoltage protection and bias supply
      checks
  • Programmable power management to optimize the performances for ultra-portable applications
  • Beamforming in transmission mode
    • Programmable single-channel delay for beam
      steering and beam focusing
    • Clock frequency up to 200 MHz
    • 5 ns delay resolution
    • From 5 ns to 20 us delay range @ 200 MHz
    • 3 us minimum delay table writing time
  • Embedded memory to store transmission patterns
    • 32 states for waveform definition, with
      waveform compression algorithm
    • Up to 4 different waveforms for each channel
  • Easy driving control
    • Control through standard Quad Serial
      Peripheral Interface (QSPI)
    • Few input signals to drive several devices
    • Single interrupt as alert signal
    • Single trigger to manage transmitting (TX) and
      receiving (RX) phases, fully automatic and
      programmable
    • Anti-glitch on TRIGGER signal during TX
      phase
  • Checksum control
  • Very low package thermal resistance
  • Latch-up free due to HV SOI technology
  • Just a few passive components needed
  • Small package: BGA 10 mm x 10 mm with 196 balls and 0.65 mm pitch
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Quantity $ per unit Savings
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$168.15
ECCN USEAR99
ECCN EUNEC
Packing TypeTray
RoHs compliantEcopack1 (*)
GradeIndustrial
Package NameFCBGA196 10x10x1.4 0.65P 0.35B

The STHVUP64 is a 64 channels monolithic high-voltage and high-speed pulser with an integrated beamformer. It is specifically designed for pulse generation in multi-channel low-power ultra-portable medical ultrasound applications. The waveforms generated by STHVUP64 are described with...
Read More

Key features
  • Pulsed wave (PW) and continuous wave (CW) mode operations:
    • 3- or 5-level ±100 V output waveform
    • Programmable ±200 mA or ±400 mA source and
      sink current in 3-level configuration (±200 mA in
      5-level configuration)
  • Fully integrated 45 Ω resistance real clamping-to-ground function
  • Fully integrated 45 Ω resistance transmitting/receiving switches (TR_SW)
    • Compliant with receiver multiplexing
      function
  • Auxiliary integrated circuits
    • Noise-blocking diodes
    • Thermal protection
    • Undervoltage protection and bias supply
      checks
  • Programmable power management to optimize the performances for ultra-portable applications
  • Beamforming in transmission mode
    • Programmable single-channel delay for beam
      steering and beam focusing
    • Clock frequency up to 200 MHz
    • 5 ns delay resolution
    • From 5 ns to 20 us delay range @ 200 MHz
    • 3 us minimum delay table writing time
  • Embedded memory to store transmission patterns
    • 32 states for waveform definition, with
      waveform compression algorithm
    • Up to 4 different waveforms for each channel
  • Easy driving control
    • Control through standard Quad Serial
      Peripheral Interface (QSPI)
    • Few input signals to drive several devices
    • Single interrupt as alert signal
    • Single trigger to manage transmitting (TX) and
      receiving (RX) phases, fully automatic and
      programmable
    • Anti-glitch on TRIGGER signal during TX
      phase
  • Checksum control
  • Very low package thermal resistance
  • Latch-up free due to HV SOI technology
  • Just a few passive components needed
  • Small package: BGA 10 mm x 10 mm with 196 balls and 0.65 mm pitch