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STM32F217IGT7

STM32F217IGT7

STM32F217IGH6TR

STM32F217IGH6TR

STM32F217IGH6

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High-performance Arm Cortex-M3 MCU with 1 Mbyte of Flash memory, 120 MHz CPU, ART Accelerator, Ethernet, HW crypto

Quantity $ per Unit Savings
1 - 9$20.460%
10 - 24$18.818%
25 - 99$18.0212%
100 - 120$15.8922%
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In stock
$20.46
Parameter NameParameter Value
Supply Voltage Min Volt1.8
Supply Voltage Max Volt3.6
Operating Temp Min Celsius-40.0
Operating Temp Max Celsius85.0
CoreArm Cortex-M3
ECCN US5A992.c
ECCN EUNEC
Packing TypeTray
RoHs compliantEcopack2
GradeIndustrial
Package NameUFBGA 176+25 10x10x0.6 P 0.65 mm

The STM32F21x family is based on the high-performance ARM®Cortex®-M3 32-bit RISC core operating at a frequency of up to 120 MHz. The family incorporates high-speed embedded memories (Flash memory up to 1 Mbyte, up to 128 Kbytes of system SRAM), up to 4 Kbytes of backup SRAM, and an extensive range of enhanced I/Os and peripherals connected to two APB buses, three AHB buses and a 32-bit multi-AHB bus matrix.


The devices also feature an adaptive real-time memory accelerator (ART Accelerator™) that allows to achieve a performance equivalent to 0 wait state program execution from Flash memory at a CPU frequency up to 120 MHz. This performance has been validated using the CoreMark® benchmark.


All devices offer three 12-bit ADCs, two DACs, a low-power RTC, twelve general-purpose 16-bit timers including two PWM timers for motor control, two general-purpose 32-bit timers. a true number random generator (RNG). They also feature standard and advanced communication interfaces. New advanced peripherals include an SDIO, an enhanced flexible static memory control (FSMC) interface (for devices offered in packages of 100 pins and more), a cryptographic acceleration cell, and a camera interface for CMOS sensors. The devices also feature standard peripherals.

Key features
  • Core: ARM® 32-bit Cortex®-M3 CPU (120 MHz max) with Adaptive real-time accelerator (ART Accelerator™) allowing 0-wait state execution performance from Flash memory, MPU, 150 DMIPS/1.25 DMIPS/MHz (Dhrystone 2.1)
  • Memories
    • Up to 1 Mbyte of Flash memory
    • 512 bytes of OTP memory
    • Up to 128 + 4 Kbytes of SRAM
    • Flexible static memory controller that supports Compact Flash, SRAM, PSRAM, NOR and NAND memories
    • LCD parallel interface, 8080/6800 modes
  • Clock, reset and supply management
    • From 1.8 to 3.6 V application supply + I/Os
    • POR, PDR, PVD and BOR
    • 4 to 26 MHz crystal oscillator
    • Internal 16 MHz factory-trimmed RC
    • 32 kHz oscillator for RTC with calibration
    • Internal 32 kHz RC with calibration
  • Low-power modes
    • Sleep, Stop and Standby modes
    • VBATsupply for RTC, 20 × 32 bit backup registers, and optional 4 Kbytes backup SRAM
  • 3 × 12-bit, 0.5 μs ADCs with up to 24 channels and up to 6 MSPS in triple interleaved mode
  • 2 × 12-bit D/A converters
  • General-purpose DMA: 16-stream controller with centralized FIFOs and burst support
  • Up to 17 timers
    • Up to twelve 16-bit and two 32-bit timers, up to 120 MHz, each with up to four IC/OC/PWM or pulse counter and quadrature (incremental) encoder input
  • Debug mode: Serial wire debug (SWD), JTAG, and Cortex®-M3 Embedded Trace Macrocell™
  • Up to 140 I/O ports with interrupt capability:
    • Up to 136 fast I/Os up to 60 MHz
    • Up to 138 5 V-tolerant I/Os
  • Up to 15 communication interfaces
    • Up to three I2C interfaces (SMBus/PMBus)
    • Up to four USARTs and two UARTs (7.5 Mbit/s, ISO 7816 interface, LIN, IrDA, modem control)
    • Up to three SPIs (30 Mbit/s), two with muxed I2S to achieve audio class accuracy via audio PLL or external PLL
    • 2 × CAN interfaces (2.0B