High-performance and DSP with DP-FPU, Arm Cortex-M7 MCU with 1 MByte Flash, 564 KBytes RAM, 550 MHz CPU, L1 cache, external memory interface, SMPS, subset of peripherals

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Parameter NameParameter Value
Supply Voltage Min Volt1.71
Supply Voltage Max Volt3.6
Operating Temp Min Celsius-40.0
Operating Temp Max Celsius85.0
CoreArm Cortex-M7
ECCN US3A991.a.2
Packing TypeTray
RoHs compliantEcopack2
Package NameLQFP 100 14x14x1.4 mm

STM32H725xE/G devices are based on the high-performance Arm® Cortex®-M7 32-bit RISC core operating at up to 550 MHz. The Cortex® -M7 core features a floating point unit (FPU) which supports Arm® double-precision (IEEE 754 compliant) and single-precision data-processing instructions and data types. The Cortex -M7 core includes 32 Kbytes of instruction cache and 32 Kbytes of data cache. STM32H725xE/G devices support a full set of DSP instructions and a memory protection unit (MPU) to enhance application security.

STM32H725xE/G devices incorporate high-speed embedded memories with up to 1 Mbyte of Flash memory, up to 564 Kbytes of RAM (including 192 Kbytes that can be shared between ITCM and AXI, plus 64 Kbytes exclusively ITCM, plus 128 Kbytes exclusively AXI, 128 Kbyte DTCM, 48 Kbytes AHB and 4 Kbytes of backup RAM), as well as an extensive range of enhanced I/Os and peripherals connected to APB buses, AHB buses, 2x32-bit multi-AHB bus matrix and a multi layer AXI interconnect supporting internal and external memory access. To improve application robustness, all memories feature error code correction (one error correction, two error detections).

The devices embed peripherals allowing mathematical/arithmetic function acceleration (CORDIC co-processor for trigonometric functions and FMAC unit for filter functions). All the devices offer three ADCs, two DACs, two operational amplifiers, two ultra-low power comparators, a low-power RTC, 4 general-purpose 32-bit timers, 12 general-purpose 16-bit timers including two PWM timers for motor control, five low-power timers, a true random number generator (RNG). The devices support four digital filters for external sigma-delta modulators (DFSDM). They also feature standard and advanced communication interfaces.

Key features
  • Core
    • 32-bit Arm® Cortex®-M7 CPU with DP-FPU, L1 cache: 32-Kbyte data cache and 32-Kbyte instruction cache allowing 0-wait state execution from embedded Flash memory and external memories, frequency up to 550 MHz, MPU, 1177 DMIPS/2.14 DMIPS/MHz (Dhrystone 2.1), and DSP instructions
  • Memories
    • Up to 1 Mbyte of embedded Flash memory with ECC
    • SRAM: total 564 Kbytes all with ECC, including 128 Kbytes of data TCM RAM for critical real-time data + 432 Kbytes of system RAM (up to 256 Kbytes can remap on instruction TCM RAM for critical real time instructions) + 4 Kbytes of backup SRAM (available in the lowest-power modes)
    • Flexible external memory controller with up to 24-bit data bus: SRAM, PSRAM, SDRAM/LPSDR SDRAM, NOR/NAND memories
    • 2 x Octo-SPI interface with XiP
    • 2 x SD/SDIO/MMC interface
    • Bootloader
  • Graphics
    • Chrom-ART Accelerator graphical hardware accelerator enabling enhanced graphical user interface to reduce CPU load
    • LCD-TFT controller supporting up to XGA resolution
  • Clock, reset and supply management
    • 1.62 V to 3.6 V application supply and I/O
    • POR, PDR, PVD and BOR
    • Dedicated USB power
    • Embedded DCDC and LDO regulator(*)VFQFPN68 variant is DCDC only
    • Internal oscillators: 64 MHz HSI, 48 MHz HSI48, 4 MHz CSI, 32 kHz LSI
    • External oscillators: 4-50 MHz HSE, 32.768 kHz LSE
  • Low power
    • Sleep, Stop and Standby modes
    • VBAT supply for RTC, 32×32-bit backup registers
  • Analog
    • 2×16-bit ADC, up to 3.6 MSPS in 16-bit: up to 22 channels and 7.2 MSPS in double-interleaved mode
    • 1 x 12-bit ADC, up to 5 MSPS in 12-bit, up to 12 channels