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STM32H7B0ZBT6

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High-performance and DSP with DP-FPU, Arm Cortex-M7 MCU with 128KBytes of Flash memory, 1376 KB SRAM, 280 MHz CPU, L1 cache, graphic accelerations, external memory interfaces and large set of peripherals

Quantity $ per Unit Savings
1 - 9$13.170%
10 - 24$12.525%
25 - 99$12.227%
100 - 249$11.3914%
250 - 500$10.2023%
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$13.17
Parameter NameParameter Value
Supply Voltage Min Volt1.62
Supply Voltage Max Volt3.6
Operating Temp Min Celsius-40.0
Operating Temp Max Celsius85.0
CoreArm Cortex-M7
ECCN US5A992.c
ECCN EUNEC
Packing TypeTray
RoHs compliantEcopack2
GradeIndustrial
Package NameLQFP 144 20x20x1.4 mm

STM32H7B0xB devices are based on the high-performance Arm® Cortex®-M7 32-bit RISC core operating at up to 280 MHz. The Cortex® -M7 core features a floating point unit (FPU) which supports Arm® double-precision (IEEE 754 compliant) and single-precision data-processing instructions and data types. STM32H7B0xB devices support a full set of DSP instructions and a memory protection unit (MPU) to enhance application security.


STM32H7B0xB devices incorporate high-speed embedded memories with a Flash memory of 128 Kbytes, around 1.4 Mbyte of RAM (including 192 Kbytes of TCM RAM, 1.18 Mbytes of user SRAM and 4 Kbytes of backup SRAM), as well as an extensive range of enhanced I/Os and peripherals connected to four APB buses, three AHB buses, a 32-bit multi-AHB bus matrix and a multi layer AXI interconnect supporting internal and external memory access.


All the devices offer two ADCs, two DACs (one dual and one single DAC), two ultra-low power comparators, a low-power RTC, 12 general-purpose 16-bit timers, two PWM timers for motor control, three low-power timers, a true random number generator (RNG), and a cryptographic acceleration cell and a HASH processor. The devices support nine digital filters for external sigma delta modulators (DFSDM). They also feature standard and advanced communication interfaces.

Key features
  • Core
    • 32-bit Arm® Cortex®-M7 core with double-precision FPU and L1 cache: 16 Kbytes of data and 16 Kbytes of instruction cache allowing to fill one cache line in a single access from the 128-bit embedded Flash memory; frequency up to 280 MHz, MPU, 599 DMIPS/ 2.14 DMIPS/MHz (Dhrystone 2.1), and DSP instructions
  • Memories
    • 128 Kbytes of Flash memory plus 1 Kbyte of OTP
    • ~1.4 Mbytes of RAM: 192 Kbytes of TCM RAM (inc. 64 Kbytes of ITCM RAM + 128 Kbytes of DTCM RAM for time critical routines), 1.18 Mbytes of user SRAM, and 4 Kbytes of SRAM in Backup domain
    • 2x Octo-SPI memory interfaces with on-the-fly
      decryption, I/O multiplexing and support for serial PSRAM/NOR, Hyper RAM/Flash frame formats, running up to 140 MHz in SRD mode and up to 110 MHz in DTR mode
    • Flexible external memory controller with up to 32-bit data bus:
      • SRAM, PSRAM, NOR Flash memory clocked up to 125 MHz in Synchronous mode

      • SDRAM/LPSDR SDRAM,

      • 8/16-bit NAND Flash memory

    • CRC calculation unit
  • Security
    • ROP, PC-ROP, active tamper, secure firmware upgrade support, Secure access mode
  • General-purpose input/outputs
    • Up to 138 I/O ports with interrupt capability
      • Fast I/Os capable of up to 133 MHz

      • Up to 164 5 V-tolerant I/Os

  • Low-power consumption
    • Stop: down to 32 µA with full RAM retention
    • Standby: 2.8 µA (Backup SRAM OFF, RTC/LSE ON, PDR OFF)
    • VBAT: 0.8 µA with RTC and LSE ON
  • Clock management
    • Internal oscillators: 64 MHz HSI, 48 MHz RC, 4 MHz CSI, 32 kHz LSI
    • External oscillators: 4-50 MHz HSE, 32.768 kHz LSE
    • 3× PLLs (1 for the sy