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STM32H7B3LIH6Q

High-performance and DSP with DP-FPU, Arm Cortex-M7 MCU with 2MBytes of Flash memory, 1376 KB SRAM, 260 MHz CPU, L1 cache, graphic accelerations, external memory interfaces, SMPS and large set of peripherals

Supply Voltage Min Volt1.62
Supply Voltage Max Volt3.6
Operating Temp Min Celsius-40.0
Operating Temp Max Celsius85.0
CoreArm Cortex-M7
ECCN US5A992.c
ECCN EUNEC
Packing TypeTray
RoHs compliantEcopack2
GradeIndustrial
Package NameTFBGA 225 13x13x1.2 P 0.8 mm

STM32H7B3xI devices are based on the high-performance Arm® Cortex®-M7 32-bit RISC core operating at up to 280 MHz. The Cortex® -M7 core features a floating point unit (FPU) which supports Arm® double-precision (IEEE 754 compliant) and single-precision data-processing instructions and data...
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Key features
  • Core
    • 32-bit Arm® Cortex®-M7 core with double-precision FPU and L1 cache: 16 Kbytes of data and 16 Kbytes of instruction cache allowing to fill one cache line in a single access from the 128-bit embedded Flash memory; frequency up to 280 MHz, MPU, 599 DMIPS/ 2.14 DMIPS/MHz (Dhrystone 2.1), and DSP instructions
  • Memories
    • 2 Mbytes of Flash memory with read while write support, plus 1 Kbyte of OTP
    • ~1.4 Mbytes of RAM: 192 Kbytes of TCM RAM (inc. 64 Kbytes of ITCM RAM + 128 Kbytes of DTCM RAM for time critical routines), 1.18 Mbytes of user SRAM, and 4 Kbytes of SRAM in Backup domain
    • 2x Octo-SPI memory interfaces with on-the-fly
      decryption, I/O multiplexing and support for serial PSRAM/NOR, Hyper RAM/Flash frame formats, running up to 140 MHz in SRD mode and up to 110 MHz in DTR mode
    • Flexible external memory controller with up to 32-bit data bus:
      • SRAM, PSRAM, NOR Flash memory clocked up to 125 MHz in Synchronous mode

      • SDRAM/LPSDR SDRAM,

      • 8/16-bit NAND Flash memory

    • CRC calculation unit
  • Security
    • ROP, PC-ROP, active tamper, secure firmware upgrade support, Secure access mode
  • General-purpose input/outputs
    • Up to 168 I/O ports with interrupt capability
      • Fast I/Os capable of up to 133 MHz

      • Up to 164 5 V-tolerant I/Os

  • Low-power consumption
    • Stop: down to 32 µA with full RAM retention
    • Standby: 2.8 µA (Backup SRAM OFF, RTC/LSE ON, PDR OFF)
    • VBAT: 0.8 µA with RTC and LSE ON
  • Clock management
    • Internal oscillators: 64 MHz HSI, 48 MHz RC, 4 MHz CSI, 32 kHz LSI
    • External oscillators: 4-50 MHz HSE, 32.768 kHz LSE
Out of Stock
Quantity $ per unit Savings
1-9$12.830%
10-24$12.384%
25-249$12.215%
250-959$12.205%
960-10000$10.8216%
Contact sales
$12.83
Supply Voltage Min Volt1.62
Supply Voltage Max Volt3.6
Operating Temp Min Celsius-40.0
Operating Temp Max Celsius85.0
CoreArm Cortex-M7
ECCN US5A992.c
ECCN EUNEC
Packing TypeTray
RoHs compliantEcopack2
GradeIndustrial
Package NameTFBGA 225 13x13x1.2 P 0.8 mm

STM32H7B3xI devices are based on the high-performance Arm® Cortex®-M7 32-bit RISC core operating at up to 280 MHz. The Cortex® -M7 core features a floating point unit (FPU) which supports Arm® double-precision (IEEE 754 compliant) and single-precision data-processing instructions and data...
Read More

Key features
  • Core
    • 32-bit Arm® Cortex®-M7 core with double-precision FPU and L1 cache: 16 Kbytes of data and 16 Kbytes of instruction cache allowing to fill one cache line in a single access from the 128-bit embedded Flash memory; frequency up to 280 MHz, MPU, 599 DMIPS/ 2.14 DMIPS/MHz (Dhrystone 2.1), and DSP instructions
  • Memories
    • 2 Mbytes of Flash memory with read while write support, plus 1 Kbyte of OTP
    • ~1.4 Mbytes of RAM: 192 Kbytes of TCM RAM (inc. 64 Kbytes of ITCM RAM + 128 Kbytes of DTCM RAM for time critical routines), 1.18 Mbytes of user SRAM, and 4 Kbytes of SRAM in Backup domain
    • 2x Octo-SPI memory interfaces with on-the-fly
      decryption, I/O multiplexing and support for serial PSRAM/NOR, Hyper RAM/Flash frame formats, running up to 140 MHz in SRD mode and up to 110 MHz in DTR mode
    • Flexible external memory controller with up to 32-bit data bus:
      • SRAM, PSRAM, NOR Flash memory clocked up to 125 MHz in Synchronous mode

      • SDRAM/LPSDR SDRAM,

      • 8/16-bit NAND Flash memory

    • CRC calculation unit
  • Security
    • ROP, PC-ROP, active tamper, secure firmware upgrade support, Secure access mode
  • General-purpose input/outputs
    • Up to 168 I/O ports with interrupt capability
      • Fast I/Os capable of up to 133 MHz

      • Up to 164 5 V-tolerant I/Os

  • Low-power consumption
    • Stop: down to 32 µA with full RAM retention
    • Standby: 2.8 µA (Backup SRAM OFF, RTC/LSE ON, PDR OFF)
    • VBAT: 0.8 µA with RTC and LSE ON
  • Clock management
    • Internal oscillators: 64 MHz HSI, 48 MHz RC, 4 MHz CSI, 32 kHz LSI
    • External oscillators: 4-50 MHz HSE, 32.768 kHz LSE