STM32MP157AAB3T

MPU with Arm Dual Cortex-A7 650 MHz, Arm Cortex-M4 real-time coprocessor, 3D GPU, TFT/MIPI DSI displays, FD-CAN

Parameters

Supply Voltage Min Volt	1.71
Supply Voltage Max Volt	3.6
Operating Temp Min Celsius	-40.0
Operating Temp Max Celsius	125.0
Core	Arm Cortex-A7
ECCN US	3A991.a.2
ECCN EU	NEC
Packing Type	Tape And Reel
RoHs compliant	Ecopack2
Grade	Industrial
Package Name	LFBGA 354 16x16x1.7 P 0.8 mm

Description

The STM32MP157A/D devices are based on the high-performance dual-core Arm® Cortex®-A7 32-bit RISC core operating at up to 800 MHz. The Cortex-A7 processor includes a 32-Kbyte L1 instruction cache for each CPU, a 32-Kbyte L1 data cache for each CPU and a 256-Kbyte level2 cache. The Cortex-A7...
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The STM32MP157A/D devices are based on the high-performance dual-core Arm^® Cortex^®-A7 32-bit RISC core operating at up to 800 MHz. The Cortex-A7 processor includes a 32-Kbyte L1 instruction cache for each CPU, a 32-Kbyte L1 data cache for each CPU and a 256-Kbyte level2 cache. The Cortex-A7 processor is a very energy-efficient application processor designed to provide rich performance in high-end wearables, and other low-power embedded and consumer applications. It provides up to 20% more single thread performance than the Cortex-A5 and provides similar performance than the Cortex-A9.

The Cortex-A7 incorporates all features of the high-performance Cortex-A15 and Cortex-A17 processors, including virtualization support in hardware, NEON™, and 128-bit AMBA^®4 AXI bus interface.

The STM32MP157A/D devices also embed a Cortex^® -M4 32-bit RISC core operating at up to 209 MHz frequency. Cortex-M4 core features a floating point unit (FPU) single precision which supports Arm^® single-precision data-processing instructions and data types. The Cortex^® -M4 supports a full set of DSP instructions and a memory protection unit (MPU) which enhances application security.

The STM32MP157A/D devices also embed a 3D graphic processing unit (Vivante^® - OpenGL^® ES 2.0) running at up to 533 MHz, with performances up to 26 Mtriangle/s, 133 Mpixel/s.

The STM32MP157A/D devices provide an external SDRAM interface supporting external memories up to 8-Gbit density (1 Gbyte), 16 or 32-bit LPDDR2/LPDDR3 or DDR3/DDR3L up to 533 MHz.

The STM32MP157A/D devices incorporate high-speed embedded memories with 708 Kbytes of Internal SRAM (including 256 Kbytes of AXI SYSRAM, 3 banks of 128 Kbytes each of AHB SRAM, 64 Kbytes of AHB SRAM in backup domain and 4 Kbytes of SRAM in backup domain), as well as an extensive range of enhanced I/Os and peripherals connected to APB buses, AHB buses, a 32-bit multi-AHB bus matrix and a 64-bit multi layer AXI interconnect supporting internal and external memories access.

All the devices offer two ADCs, two DACs, a low-power RTC, 12 general-purpose 16-bit timers, two PWM timers for motor control, five low-power timers, a true random number generator (RNG). The devices support six digital filters for external sigma delta modulators (DFSDM). They also feature standard and advanced communication interfaces.

Key features

Key features
Core 32-bit dual-core Arm^® Cortex^®-A7 L1 32-Kbyte I / 32-Kbyte D for each core 256-Kbyte unified level 2 cache Arm^® NEON™ and Arm^® TrustZone^® 32-bit Arm^® Cortex^®-M4 with FPU/MPU Up to 209 MHz (Up to 703 CoreMark^®) Memories External DDR memory up to 1 Gbyte up to LPDDR2/LPDDR3-1066 16/32-bit up to DDR3/DDR3L-1066 16/32-bit 708 Kbytes of internal SRAM: 256 Kbytes of AXI SYSRAM + 384 Kbytes of AHB SRAM + 64 Kbytes of AHB SRAM in Backup domain and 4 Kbytes of SRAM in Backup domain Dual mode Quad-SPI memory interface Flexible external memory controller with up to 16-bit data bus: parallel interface to connect external ICs and SLC NAND memories with up to 8-bit ECC Security/safety TrustZone^® peripherals, active tamper Cortex^®-M4 resources isolation Reset and power management 1.71 V to 3.6 V I/Os supply (5 V-tolerant I/Os) POR, PDR, PVD and BOR On-chip LDOs (RETRAM, BKPSRAM, DSI 1.2 V, USB 1.8 V, 1.1 V) Backup regulator (~0.9 V) Internal temperature sensors Low-power modes: Sleep, Stop and Standby DDR memory retention in Standby mode Controls for PMIC companion chip Low-power consumption Total current consumption down to 2 µA (Standby mode, no RTC, no LSE, no BKPSRAM, no RETRAM) Clock management Internal oscillators: 64 MHz HSI oscillator, 4 MHz CSI oscillator, 32 kHz LSI oscillator Externa

Out of Stock

Quantity	$ per unit	Savings
1-9	$15.37	4%
10-24	$12.44	15%
25-99	$11.57	21%
100-249	$10.15	31%
250-10000	$9.56	35%
10000 +	Contact sales

$14.71