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Ultra-low-power 8-bit MCU with 8 Kbytes Flash, 16 MHz CPU, integrated EEPROM
| Supply Voltage Min Volt | 1.65 |
| Supply Voltage Max Volt | 3.6 |
| Operating Temp Min Celsius | -40.0 |
| Operating Temp Max Celsius | 85.0 |
| Core | STM8 |
| ECCN US | EAR99 |
| ECCN EU | NEC |
| Packing Type | Tray |
| RoHs compliant | Ecopack2 |
| Grade | Industrial |
| Package Name | LQFP 48 7x7x1.4 mm |
The low-density STM8L151x2/3 ultra-low-power devices feature an enhanced STM8 CPU core providing increased processing power (up to 16 MIPS at 16 MHz) while maintaining the advantages of a CISC architecture with improved code density, a 24-bit linear addressing space and an optimized architecture...
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| Quantity | $ per unit | Savings |
|---|---|---|
| 1-1499 | $2.64 | 0% |
| 1500-10000 | $1.57 | 41% |
| 10000 + |
Contact sales |
|
| Supply Voltage Min Volt | 1.65 |
| Supply Voltage Max Volt | 3.6 |
| Operating Temp Min Celsius | -40.0 |
| Operating Temp Max Celsius | 85.0 |
| Core | STM8 |
| ECCN US | EAR99 |
| ECCN EU | NEC |
| Packing Type | Tray |
| RoHs compliant | Ecopack2 |
| Grade | Industrial |
| Package Name | LQFP 48 7x7x1.4 mm |
The low-density STM8L151x2/3 ultra-low-power devices feature an enhanced STM8 CPU core providing increased processing power (up to 16 MIPS at 16 MHz) while maintaining the advantages of a CISC architecture with improved code density, a 24-bit linear addressing space and an optimized architecture...
Read More
|