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Ultra-low-power 8-bit MCU with 4 Kbytes Flash, 16 MHz CPU, integrated EEPROM
Supply Voltage Min Volt | 1.65 |
Supply Voltage Max Volt | 3.6 |
Operating Temp Min Celsius | -40.0 |
Operating Temp Max Celsius | 125.0 |
Core | STM8 |
ECCN US | EAR99 |
ECCN EU | NEC |
Packing Type | Tape And Reel |
RoHs compliant | Ecopack2 |
Grade | Industrial |
Package Name | UFQFPN 28 4x4x0.55 mm |
The low-density STM8L151x2/3 ultra-low-power devices feature an enhanced STM8 CPU core providing increased processing power (up to 16 MIPS at 16 MHz) while maintaining the advantages of a CISC architecture with improved code density, a 24-bit linear addressing space and an optimized architecture...
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Quantity | $ per unit | Savings |
---|---|---|
1-9 | $2.62 | 0% |
10-99 | $2.35 | 10% |
100-249 | $1.89 | 28% |
250-499 | $1.77 | 32% |
500-999 | $1.55 | 41% |
1000-2999 | $1.41 | 46% |
3000-10000 | $1.20 | 54% |
10000 + |
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Supply Voltage Min Volt | 1.65 |
Supply Voltage Max Volt | 3.6 |
Operating Temp Min Celsius | -40.0 |
Operating Temp Max Celsius | 125.0 |
Core | STM8 |
ECCN US | EAR99 |
ECCN EU | NEC |
Packing Type | Tape And Reel |
RoHs compliant | Ecopack2 |
Grade | Industrial |
Package Name | UFQFPN 28 4x4x0.55 mm |
The low-density STM8L151x2/3 ultra-low-power devices feature an enhanced STM8 CPU core providing increased processing power (up to 16 MIPS at 16 MHz) while maintaining the advantages of a CISC architecture with improved code density, a 24-bit linear addressing space and an optimized architecture...
Read More
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