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Ultra-low-power 8-bit MCU with 64 Kbytes Flash, 16 MHz CPU, integrated EEPROM, AES
Supply Voltage Min Volt | 1.65 |
Supply Voltage Max Volt | 3.6 |
Operating Temp Min Celsius | -40.0 |
Operating Temp Max Celsius | 85.0 |
Core | STM8 |
ECCN US | 5A992.c |
ECCN EU | NEC |
Packing Type | Tray |
RoHs compliant | Ecopack2 |
Grade | Industrial |
Package Name | LQFP 64 10x10x1.4 mm |
The high-density STM8L162x8 ultra-low-power devices feature an enhanced STM8 CPU core providing increased processing power (up to 16 MIPS at 16 MHz) while maintaining the advantages of a CISC architecture with improved code density, a 24-bit linear addressing space and an optimized architecture for...
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Quantity | $ per unit | Savings |
---|---|---|
1-9 | $4.10 | 0% |
10-99 | $3.49 | 15% |
100-249 | $3.01 | 27% |
250-499 | $2.58 | 37% |
500-959 | $2.57 | 37% |
960-10000 | $1.95 | 52% |
10000 + |
Contact sales |
Supply Voltage Min Volt | 1.65 |
Supply Voltage Max Volt | 3.6 |
Operating Temp Min Celsius | -40.0 |
Operating Temp Max Celsius | 85.0 |
Core | STM8 |
ECCN US | 5A992.c |
ECCN EU | NEC |
Packing Type | Tray |
RoHs compliant | Ecopack2 |
Grade | Industrial |
Package Name | LQFP 64 10x10x1.4 mm |
The high-density STM8L162x8 ultra-low-power devices feature an enhanced STM8 CPU core providing increased processing power (up to 16 MIPS at 16 MHz) while maintaining the advantages of a CISC architecture with improved code density, a 24-bit linear addressing space and an optimized architecture for...
Read More
|