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VB56G4AEGK/1

VB56G4AEGK/1

Active

VB56G4AEGK

Automotive grade 1.5 megapixel backside illuminated global shutter image sensor

Operating Temp Min Celsius-40.0
Operating Temp Max Celsius105.0
ECCN USEAR99
ECCN EUNEC
Packing TypeTray
RoHs compliantEcopack2
GradeAutomotive
Package NameCAV OBGA48 6.2X6.9 F6X8 0.8 042

The VB56G4A is a 1.5 megapixel global shutter image sensor designed for automotive driver monitoring applications.Using pre-eminent 3D stacking and ST patented processes, the sensor performs outstandingly in the near infrared region (940 nm). More precisely, thanks to backside illumination...
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Key features
  • Automotive compliancy
    • AEC-Q100 grade 2 qualified
    • Operating junction temperature: -40°C to 125°C
  • Ultra compact 1.5 megapixel image sensor
    • Global shutter architecture, 3D stacked sensor 40 nm/65 nm
    • 2.61 µm x 2.61 µm BSI (backside illuminated) pixel
    • 1.5 megapixel monochrome sensor (1124 x 1364)
    • Package: OBGA
      • Size: 6.2 mm x 6.9 mm
      • Matrix: 6 x 8 balls
      • Ball pitch: 0.8 mm
  • Easy integration
    • Embedded autoexposure
    • Programmable sequences of 4-frame contexts
    • 8 programmable GPIOs
      • NIR (near infrared) illumination control outputs, synchronized with sensor integration periods
      • PWM (pulse-width modulation) control
      • Master/Slave external frame start
    • Automatic dark calibration
    • Dynamic pixel-defective correction
    • Image cropping
    • Mirror/flip readout
    • Binning and subsampling (x2 and x4)
    • Typical power consumption is 145 mW at 60 fps
    • Dual lane transmitter MIPI CSI-2 up to 1.5 Gbps per lane
  • Unique image performance
    • Peak quantum efficiency 24% @ 940 nm
    • Linear dynamic range up to 60 dB
    • Up to 88 frames per second at full resolution
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Operating Temp Min Celsius-40.0
Operating Temp Max Celsius105.0
ECCN USEAR99
ECCN EUNEC
Packing TypeTray
RoHs compliantEcopack2
GradeAutomotive
Package NameCAV OBGA48 6.2X6.9 F6X8 0.8 042

The VB56G4A is a 1.5 megapixel global shutter image sensor designed for automotive driver monitoring applications.Using pre-eminent 3D stacking and ST patented processes, the sensor performs outstandingly in the near infrared region (940 nm). More precisely, thanks to backside illumination...
Read More

Key features
  • Automotive compliancy
    • AEC-Q100 grade 2 qualified
    • Operating junction temperature: -40°C to 125°C
  • Ultra compact 1.5 megapixel image sensor
    • Global shutter architecture, 3D stacked sensor 40 nm/65 nm
    • 2.61 µm x 2.61 µm BSI (backside illuminated) pixel
    • 1.5 megapixel monochrome sensor (1124 x 1364)
    • Package: OBGA
      • Size: 6.2 mm x 6.9 mm
      • Matrix: 6 x 8 balls
      • Ball pitch: 0.8 mm
  • Easy integration
    • Embedded autoexposure
    • Programmable sequences of 4-frame contexts
    • 8 programmable GPIOs
      • NIR (near infrared) illumination control outputs, synchronized with sensor integration periods
      • PWM (pulse-width modulation) control
      • Master/Slave external frame start
    • Automatic dark calibration
    • Dynamic pixel-defective correction
    • Image cropping
    • Mirror/flip readout
    • Binning and subsampling (x2 and x4)
    • Typical power consumption is 145 mW at 60 fps
    • Dual lane transmitter MIPI CSI-2 up to 1.5 Gbps per lane
  • Unique image performance
    • Peak quantum efficiency 24% @ 940 nm
    • Linear dynamic range up to 60 dB
    • Up to 88 frames per second at full resolution