VB56G4AEGK

Automotive grade 1.5 megapixel backside illuminated global shutter image sensor

Parameters

Operating Temp Min Celsius	-40.0
Operating Temp Max Celsius	105.0
ECCN US	EAR99
ECCN EU	NEC
Packing Type	Tray
RoHs compliant	Ecopack2
Grade	Automotive
Package Name	OBGA

Description

The VB56G4A is a 1.5 megapixel global shutter image sensor designed for automotive driver monitoring applications.Using pre-eminent 3D stacking and ST patented processes, the sensor performs outstandingly in the near infrared region (940 nm). More precisely, thanks to backside illumination...
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Key features

Key features
Automotive compliancy AEC-Q100 grade 2 qualified Operating junction temperature: -40°C to 125°C Ultra compact 1.5 megapixel image sensor Global shutter architecture, 3D stacked sensor 40 nm/65 nm 2.61 µm x 2.61 µm BSI (backside illuminated) pixel 1.5 megapixel monochrome sensor (1124 x 1364) Package: OBGA Size: 6.2 mm x 6.9 mm Matrix: 6 x 8 balls Ball pitch: 0.8 mm Easy integration Embedded autoexposure Programmable sequences of 4-frame contexts 8 programmable GPIOs NIR (near infrared) illumination control outputs, synchronized with sensor integration periods PWM (pulse-width modulation) control Master/Slave external frame start Automatic dark calibration Dynamic pixel-defective correction Image cropping Mirror/flip readout Binning and subsampling (x2 and x4) Typical power consumption is 145 mW at 60 fps Dual lane transmitter MIPI CSI-2 up to 1.5 Gbps per lane Unique image performance Peak quantum efficiency 24% @ 940 nm Linear dynamic range up to 60 dB Up to 88 frames per second at full resolution

Out of Stock

Quantity	$ per unit	Savings
1-500	$0.00	0%
500 +	Contact sales

$0.00

Parameters

Operating Temp Min Celsius	-40.0
Operating Temp Max Celsius	105.0
ECCN US	EAR99
ECCN EU	NEC
Packing Type	Tray
RoHs compliant	Ecopack2
Grade	Automotive
Package Name	OBGA

Description

Key features

Key features
Automotive compliancy AEC-Q100 grade 2 qualified Operating junction temperature: -40°C to 125°C Ultra compact 1.5 megapixel image sensor Global shutter architecture, 3D stacked sensor 40 nm/65 nm 2.61 µm x 2.61 µm BSI (backside illuminated) pixel 1.5 megapixel monochrome sensor (1124 x 1364) Package: OBGA Size: 6.2 mm x 6.9 mm Matrix: 6 x 8 balls Ball pitch: 0.8 mm Easy integration Embedded autoexposure Programmable sequences of 4-frame contexts 8 programmable GPIOs NIR (near infrared) illumination control outputs, synchronized with sensor integration periods PWM (pulse-width modulation) control Master/Slave external frame start Automatic dark calibration Dynamic pixel-defective correction Image cropping Mirror/flip readout Binning and subsampling (x2 and x4) Typical power consumption is 145 mW at 60 fps Dual lane transmitter MIPI CSI-2 up to 1.5 Gbps per lane Unique image performance Peak quantum efficiency 24% @ 940 nm Linear dynamic range up to 60 dB Up to 88 frames per second at full resolution