VB56G4AEGK

Automotive grade 1.5 megapixel backside illuminated global shutter image sensor

Parameters

Operating Temp Min Celsius	-40.0
Operating Temp Max Celsius	105.0
ECCN US	EAR99
ECCN EU	NEC
Packing Type	Tray
RoHs compliant	Ecopack2
Grade	Automotive
Package Name	CAV OBGA48 6.2X6.9 F6X8 0.8 042

Description

The VB56G4A is a 1.5 megapixel global shutter image sensor designed for automotive driver monitoring applications.Using pre-eminent 3D stacking and ST patented processes, the sensor performs outstandingly in the near infrared region (940 nm). More precisely, thanks to backside illumination...
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Key features

Key features
Automotive compliancy AEC-Q100 grade 2 qualified Operating junction temperature: -40°C to 125°C Ultra compact 1.5 megapixel image sensor Global shutter architecture, 3D stacked sensor 40 nm/65 nm 2.61 µm x 2.61 µm BSI (backside illuminated) pixel 1.5 megapixel monochrome sensor (1124 x 1364) Package: OBGA Size: 6.2 mm x 6.9 mm Matrix: 6 x 8 balls Ball pitch: 0.8 mm Easy integration Embedded autoexposure Programmable sequences of 4-frame contexts 8 programmable GPIOs NIR (near infrared) illumination control outputs, synchronized with sensor integration periods PWM (pulse-width modulation) control Master/Slave external frame start Automatic dark calibration Dynamic pixel-defective correction Image cropping Mirror/flip readout Binning and subsampling (x2 and x4) Typical power consumption is 145 mW at 60 fps Dual lane transmitter MIPI CSI-2 up to 1.5 Gbps per lane Unique image performance Peak quantum efficiency 24% @ 940 nm Linear dynamic range up to 60 dB Up to 88 frames per second at full resolution

Out of Stock

Quantity	$ per unit	Savings
1-500	$0.00	0%
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Parameters

Operating Temp Min Celsius	-40.0
Operating Temp Max Celsius	105.0
ECCN US	EAR99
ECCN EU	NEC
Packing Type	Tray
RoHs compliant	Ecopack2
Grade	Automotive
Package Name	CAV OBGA48 6.2X6.9 F6X8 0.8 042

Description

Key features

Key features
Automotive compliancy AEC-Q100 grade 2 qualified Operating junction temperature: -40°C to 125°C Ultra compact 1.5 megapixel image sensor Global shutter architecture, 3D stacked sensor 40 nm/65 nm 2.61 µm x 2.61 µm BSI (backside illuminated) pixel 1.5 megapixel monochrome sensor (1124 x 1364) Package: OBGA Size: 6.2 mm x 6.9 mm Matrix: 6 x 8 balls Ball pitch: 0.8 mm Easy integration Embedded autoexposure Programmable sequences of 4-frame contexts 8 programmable GPIOs NIR (near infrared) illumination control outputs, synchronized with sensor integration periods PWM (pulse-width modulation) control Master/Slave external frame start Automatic dark calibration Dynamic pixel-defective correction Image cropping Mirror/flip readout Binning and subsampling (x2 and x4) Typical power consumption is 145 mW at 60 fps Dual lane transmitter MIPI CSI-2 up to 1.5 Gbps per lane Unique image performance Peak quantum efficiency 24% @ 940 nm Linear dynamic range up to 60 dB Up to 88 frames per second at full resolution