VD16GZCCA/RW

Compact and high-sensitivity 1.53 megapixel RGB-IR global shutter image sensor

Parameters

Operating Temp Min Celsius	-30.0
Operating Temp Max Celsius	85.0
ECCN US	EAR99
ECCN EU	NEC
Packing Type	Tape Mounted
RoHs compliant	N/A
Grade	Industrial
Package Name	DIE

Description

The VD16GZ is part of the new generation of image sensors developed by STMicroelectronics for professional and consumer vision applications. Leveraging state-of-the-art technologies developed by ST's own foundry, the sensor provides outstanding performance in color and near infrared. With its...
Read More

Key features

Key features
Cutting-edge performance of ST proprietary pixel: BSI structure: Provides superior QE, MTF, and angular response. Full DTI technology: Further increases sensitivity and sharpness. Versatile imaging: Benefits both color and NIR (850 nm, 940 nm) image capture. Reliable supply: Proprietary technology from ST foundry in France, ensures a safe supply. Easy integration into your system: Ultracompact die: Centered design to minimize your system size. Small optical format: 4.6 mm (1/4'') at full resolution and 3.7 mm (1/5'') with 1 MP crop. Low-power consumption: Ideal for battery-powered devices. Robust design: Ensures high image quality at various temperatures. A complete toolbox of in-sensor features: Stunning images: Achieved with in-sensor AE and various corrections. Data optimization: Multiple features to optimize data size and frame rates such as crop, and programmable sequences. Enhanced controls: 8 GPIOs enabling extra controls such as trigger or LED synchronization. Seamless connection to embedded processing platforms: MIPI CSI-2 interface: 1 or 2 lanes enabling direct connection to entry-level cost-effective processing platforms. Turnkey solutions: Start your development immediately with our sensor boards, modules, and drivers for the VD16GZ image sensor. The VD16GZ color and near infrared image sensor is also available in monochrome (VD56G3) and color RGB (VD66GY) versions.

Out of Stock

Quantity	$ per unit	Savings
1-500	$11.73	0%
500 +	Contact sales

$11.73

Parameters

Operating Temp Min Celsius	-30.0
Operating Temp Max Celsius	85.0
ECCN US	EAR99
ECCN EU	NEC
Packing Type	Tape Mounted
RoHs compliant	N/A
Grade	Industrial
Package Name	DIE

Description

Key features

Key features
Cutting-edge performance of ST proprietary pixel: BSI structure: Provides superior QE, MTF, and angular response. Full DTI technology: Further increases sensitivity and sharpness. Versatile imaging: Benefits both color and NIR (850 nm, 940 nm) image capture. Reliable supply: Proprietary technology from ST foundry in France, ensures a safe supply. Easy integration into your system: Ultracompact die: Centered design to minimize your system size. Small optical format: 4.6 mm (1/4'') at full resolution and 3.7 mm (1/5'') with 1 MP crop. Low-power consumption: Ideal for battery-powered devices. Robust design: Ensures high image quality at various temperatures. A complete toolbox of in-sensor features: Stunning images: Achieved with in-sensor AE and various corrections. Data optimization: Multiple features to optimize data size and frame rates such as crop, and programmable sequences. Enhanced controls: 8 GPIOs enabling extra controls such as trigger or LED synchronization. Seamless connection to embedded processing platforms: MIPI CSI-2 interface: 1 or 2 lanes enabling direct connection to entry-level cost-effective processing platforms. Turnkey solutions: Start your development immediately with our sensor boards, modules, and drivers for the VD16GZ image sensor. The VD16GZ color and near infrared image sensor is also available in monochrome (VD56G3) and color RGB (VD66GY) versions.