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VD55G0CCA1/RW

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Consumer Global Shutter 0.4Mp

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Parameter NameParameter Value
Operating Temp Min Celsius-30.0
Operating Temp Max Celsius85.0
ECCN USEAR99
ECCN EUNEC
Packing TypeTape Mounted
RoHs compliantN/A
GradeIndustrial
Package NameGOOD DIE

The VD55G0 is a global shutter image sensor with high BSI performance which captures up to 210 frames per second in a 644 x 604 resolution format. The pixel construction of this device minimizes crosstalk while enabling a high quantum efficiency (QE) in the near infrared spectrum.

Key features
  • Global shutter technology, ST proprietary single layer
  • 3D stacked sensor 40 nm/65 nm
  • 2.61 µm x 2.61 µm BSI pixel with full CDTI (capacitive deep trench)
  • High performance with excellentQE (quantum efficiency)MTF (modulation transfer function) up to near IRPerfect PLS (shutter efficiency)
  • Smallest sensor on market with:Compact die size: 2.6 mm x 2.5 mm640 pixel x 600 pixel resolutionVery small pixel array, 1.67 mm x 1.57 mmOptical format between 1/9 inch
  • Operating junction temperature: -30°C to 85°C
  • Single lane transmitter MIPI CSI-2 (copyright© 2005-2010 MIPI Alliance, Inc. Standard for Camera Serial Interface 2 (CSI-2) version 1.0) version 1.3, 1.2 Gbps per lane
  • Fast mode+ I2C control interface
  • Integrated temperature sensor
  • Up to 210 fps (frames per second) at full resolution and 260 fps with VGA resolution
  • Programmable sequences of 4-frame contexts, including frame parameters
  • Automatic dark calibration
  • Dynamic defective correction
  • Embedded auto-exposure
  • 4 multiple function IO, dynamically programmable with frame contexts (GPIO, strobe pulse, pulse-width modulation, V sync)
  • Up to 4 illumination control outputs, synchronized with sensor integration periods and master/slave external frame start
  • Mirror/flip readout
  • Fully sequenceable with frame contexts
  • Crop
  • Binning (x2 and x4)
  • Analog binning: 320x240 @ 500fps, 320x252 @ 480fps, 320x300 @ 414 fps
  • Sub sampling (x2 and x4)