VD55G0CCA1/RW

Compact and high-sensitivity 0.38 megapixel monochrome global shutter image sensor

Parameters

Operating Temp Min Celsius	-30.0
Operating Temp Max Celsius	85.0
ECCN US	EAR99
ECCN EU	NEC
Packing Type	Tape Mounted
RoHs compliant	N/A
Grade	Industrial
Package Name	GOOD DIE

Description

The VD55G0 is a global shutter image sensor with high BSI performance which captures up to 210 frames per second in a 644 x 604 resolution format. The pixel construction of this device minimizes crosstalk while enabling a high quantum efficiency (QE) in the near infrared spectrum.

Key features

Key features
Global shutter technology, ST proprietary single layer 3D stacked sensor 40 nm/65 nm 2.61 µm x 2.61 µm BSI pixel with full CDTI (capacitive deep trench) High performance with excellentQE (quantum efficiency)MTF (modulation transfer function) up to near IRPerfect PLS (shutter efficiency) Smallest sensor on market with:Compact die size: 2.6 mm x 2.5 mm640 pixel x 600 pixel resolutionVery small pixel array, 1.67 mm x 1.57 mmOptical format between 1/9 inch Operating junction temperature: -30°C to 85°C Single lane transmitter MIPI CSI-2 (copyright© 2005-2010 MIPI Alliance, Inc. Standard for Camera Serial Interface 2 (CSI-2) version 1.0) version 1.3, 1.2 Gbps per lane Fast mode+ I2C control interface Integrated temperature sensor Up to 210 fps (frames per second) at full resolution and 260 fps with VGA resolution Programmable sequences of 4-frame contexts, including frame parameters Automatic dark calibration Dynamic defective correction Embedded auto-exposure 4 multiple function IO, dynamically programmable with frame contexts (GPIO, strobe pulse, pulse-width modulation, V sync) Up to 4 illumination control outputs, synchronized with sensor integration periods and master/slave external frame start Mirror/flip readout Fully sequenceable with frame contexts Crop Binning (x2 and x4) Analog binning: 320x240 @ 500fps, 320x252 @ 480fps, 320x300 @ 414 fps Sub sampling (x2 and x4)

Out of Stock

Quantity	$ per unit	Savings
1-9	$6.17	0%
10-24	$5.58	10%
25-99	$5.32	14%
100-249	$4.62	25%
250-499	$4.41	29%
500	$4.02	35%
500 +	Contact sales

$6.17

Parameters

Operating Temp Min Celsius	-30.0
Operating Temp Max Celsius	85.0
ECCN US	EAR99
ECCN EU	NEC
Packing Type	Tape Mounted
RoHs compliant	N/A
Grade	Industrial
Package Name	GOOD DIE

Description

Key features

Key features
Global shutter technology, ST proprietary single layer 3D stacked sensor 40 nm/65 nm 2.61 µm x 2.61 µm BSI pixel with full CDTI (capacitive deep trench) High performance with excellentQE (quantum efficiency)MTF (modulation transfer function) up to near IRPerfect PLS (shutter efficiency) Smallest sensor on market with:Compact die size: 2.6 mm x 2.5 mm640 pixel x 600 pixel resolutionVery small pixel array, 1.67 mm x 1.57 mmOptical format between 1/9 inch Operating junction temperature: -30°C to 85°C Single lane transmitter MIPI CSI-2 (copyright© 2005-2010 MIPI Alliance, Inc. Standard for Camera Serial Interface 2 (CSI-2) version 1.0) version 1.3, 1.2 Gbps per lane Fast mode+ I2C control interface Integrated temperature sensor Up to 210 fps (frames per second) at full resolution and 260 fps with VGA resolution Programmable sequences of 4-frame contexts, including frame parameters Automatic dark calibration Dynamic defective correction Embedded auto-exposure 4 multiple function IO, dynamically programmable with frame contexts (GPIO, strobe pulse, pulse-width modulation, V sync) Up to 4 illumination control outputs, synchronized with sensor integration periods and master/slave external frame start Mirror/flip readout Fully sequenceable with frame contexts Crop Binning (x2 and x4) Analog binning: 320x240 @ 500fps, 320x252 @ 480fps, 320x300 @ 414 fps Sub sampling (x2 and x4)