VD66GYCCA/RW

VD66GY 1.53-megapixel color global shutter CMOS image sensor die in reconstructed wafer

Parameters

Operating Temp Min Celsius	-30.0
Operating Temp Max Celsius	85.0
ECCN US	EAR99
ECCN EU	NEC
Packing Type	Tape Mounted
RoHs compliant	N/A
Grade	Industrial
Package Name	DIE

Description

The VD66GY is part of a brand-new complete series of image sensors developed by STMicroelectronics for professional and consumer vision applications. Leveraging state-of-the-art technologies developed by STMicroelectronics own foundry, the sensor provides outstanding performance enabling to capture...
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Key features

Key features
Cutting-edge performance of ST proprietary pixel: BSI structure provides superior QE, MTF, and angular response. Full DTI technology further increases sensitivity and sharpness. Excellent response across the whole color spectrum. Proprietary technology from ST foundry in France, ensuring safe supply. Easy integration into your system: Ultracompact die with centered design to minimize your system size. Small optical format: 4.6 mm (1/4'') at full resolution and 3.7 mm (1/5'') with 1 MP crop. Low power, ideal for battery-powered devices. Robust design and image quality in temperature. A complete toolbox of in-sensor features: Stunning images with in-sensor autoexposure and various corrections. Multiple features to optimize data size and frame rates such as crop, binning, and programmable sequences. 8 GPIOs enabling extra controls such as trigger or LED synchronization. Seamless connection to embedded processing platforms: 1 or 2 lanes MIPI CSI-2 interface enabling straight connection to entry-level cost-effective processing platforms. Start immediately your development with our turnkey sensor boards, modules, and drivers for the VD66GY image sensor. The VD66GY color image sensor is also available in monochrome (VD56G3) and RGB-NIR versions (VD16GZ).

Out of Stock

Parameters

Operating Temp Min Celsius	-30.0
Operating Temp Max Celsius	85.0
ECCN US	EAR99
ECCN EU	NEC
Packing Type	Tape Mounted
RoHs compliant	N/A
Grade	Industrial
Package Name	DIE

Description

Key features

Key features
Cutting-edge performance of ST proprietary pixel: BSI structure provides superior QE, MTF, and angular response. Full DTI technology further increases sensitivity and sharpness. Excellent response across the whole color spectrum. Proprietary technology from ST foundry in France, ensuring safe supply. Easy integration into your system: Ultracompact die with centered design to minimize your system size. Small optical format: 4.6 mm (1/4'') at full resolution and 3.7 mm (1/5'') with 1 MP crop. Low power, ideal for battery-powered devices. Robust design and image quality in temperature. A complete toolbox of in-sensor features: Stunning images with in-sensor autoexposure and various corrections. Multiple features to optimize data size and frame rates such as crop, binning, and programmable sequences. 8 GPIOs enabling extra controls such as trigger or LED synchronization. Seamless connection to embedded processing platforms: 1 or 2 lanes MIPI CSI-2 interface enabling straight connection to entry-level cost-effective processing platforms. Start immediately your development with our turnkey sensor boards, modules, and drivers for the VD66GY image sensor. The VD66GY color image sensor is also available in monochrome (VD56G3) and RGB-NIR versions (VD16GZ).