X-NUCLEO-IKS4A1

Motion MEMS and environmental sensor expansion board for STM32 Nucleo

Parameters

Target Application	Ultrasound imaging
Core Product	LPS22DFTR, LIS2DUXS12TR, LSM6DSV16XTR, LIS2MDLTR, LSM6DSO16ISTR
ECCN US	EAR99
ECCN EU	NEC
Packing Type	Not Applicable
RoHs compliant	Ecopack2
Grade	Industrial
Package Name	CARD

Description

The X-NUCLEO-IKS4A1 is a motion MEMS and environmental sensor evaluation board kit consisting of the main board X-NUCLEO-IQS4A1, which hosts the motion MEMS and environmental sensors, and the detachable add-on board STEVAL-MKE001A, which hosts the Qvar swipe electrodes.This expansion board allows...
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Key features

Key features
Wide range of motion and environmental sensors: LSM6DSO16IS: MEMS 3D accelerometer (±2/±4/±8/±16 g) + 3D gyroscope (±125/±250/±500/±1000/±2000 dps) with ISPU (Intelligent Processing Unit) LIS2MDL: MEMS 3D magnetometer (±50 gauss) LIS2DUXS12: Ultra low-power MEMS 3D accelerometer (±2/±4/±8/±16 g) with Qvar, AI, & anti-aliasing LPS22DF: Low-power and high-precision MEMS pressure sensor, 260-1260 hPa absolute digital output barometer SHT40AD1B: High-accuracy, ultra-low-power relative humidity and temperature sensor (by Sensirion) STTS22H: Low-voltage, ultralow-power, 0.5 °C accuracy temperature sensor (–40 °C to +125 °C) LSM6DSV16X: MEMS 3D accelerometer (±2/±4/±8/±16 g) + 3D gyroscope (±125/±250/±500/±1000/±2000/±4000 dps) with embedded sensor fusion, AI, Qvar LSM6DSV16X: MEMS 3D accelerometer (±2/±4/±8/±16 g) + 3D gyroscope (±125/±250/±500/±1000/±2000/±4000 dps) with embedded sensor fusion, AI, Qvar DIL 24-pin socket available for additional MEMS adapters and other sensors Compatible with X-CUBE-MEMS1, an expansion software package for STM32Cube Equipped with Qvar touch/swipe electrode I²C sensor hub features on LSM6DSO16IS and LSM6DSV16X available Supported by MEMS-Studio, a software solution for MEMS sensors with graphical no-code design of algorithms and development of embedded AI features MIPI I3C® compatibility for communication with LIS2DUXS12, LSM6DSV16X and LPS22DF Compatible with STM32 Nucleo boards Equipped with Arduino UNO R3 connector Equipped with industrial connector for IR sensor (STHS34PF80) application development. It can be connected at the same time of external MEMS through DIL24 adapter Available interface for external camera module applications coupled with LSM6DSV16X through aux SPI (3/4 w) RoHS compliant WEEE compliant UKCA compliant

In stock

Quantity	$ per unit	Savings
1-2	$34.27	0%
2 +	Contact sales

$34.27

Parameters

Target Application	Ultrasound imaging
Core Product	LPS22DFTR, LIS2DUXS12TR, LSM6DSV16XTR, LIS2MDLTR, LSM6DSO16ISTR
ECCN US	EAR99
ECCN EU	NEC
Packing Type	Not Applicable
RoHs compliant	Ecopack2
Grade	Industrial
Package Name	CARD

Description

Key features

Key features
Wide range of motion and environmental sensors: LSM6DSO16IS: MEMS 3D accelerometer (±2/±4/±8/±16 g) + 3D gyroscope (±125/±250/±500/±1000/±2000 dps) with ISPU (Intelligent Processing Unit) LIS2MDL: MEMS 3D magnetometer (±50 gauss) LIS2DUXS12: Ultra low-power MEMS 3D accelerometer (±2/±4/±8/±16 g) with Qvar, AI, & anti-aliasing LPS22DF: Low-power and high-precision MEMS pressure sensor, 260-1260 hPa absolute digital output barometer SHT40AD1B: High-accuracy, ultra-low-power relative humidity and temperature sensor (by Sensirion) STTS22H: Low-voltage, ultralow-power, 0.5 °C accuracy temperature sensor (–40 °C to +125 °C) LSM6DSV16X: MEMS 3D accelerometer (±2/±4/±8/±16 g) + 3D gyroscope (±125/±250/±500/±1000/±2000/±4000 dps) with embedded sensor fusion, AI, Qvar LSM6DSV16X: MEMS 3D accelerometer (±2/±4/±8/±16 g) + 3D gyroscope (±125/±250/±500/±1000/±2000/±4000 dps) with embedded sensor fusion, AI, Qvar DIL 24-pin socket available for additional MEMS adapters and other sensors Compatible with X-CUBE-MEMS1, an expansion software package for STM32Cube Equipped with Qvar touch/swipe electrode I²C sensor hub features on LSM6DSO16IS and LSM6DSV16X available Supported by MEMS-Studio, a software solution for MEMS sensors with graphical no-code design of algorithms and development of embedded AI features MIPI I3C® compatibility for communication with LIS2DUXS12, LSM6DSV16X and LPS22DF Compatible with STM32 Nucleo boards Equipped with Arduino UNO R3 connector Equipped with industrial connector for IR sensor (STHS34PF80) application development. It can be connected at the same time of external MEMS through DIL24 adapter Available interface for external camera module applications coupled with LSM6DSV16X through aux SPI (3/4 w) RoHS compliant WEEE compliant UKCA compliant