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ACEPACK 2 power module, triple boost (650 V, 49 mOhm typ.) plus half-bridge topology (650 V, 23.5 mOhm typ.) SiC Power MOSFET gen. 3 with NTC and capacitance
ECCN US | EAR99 |
ECCN EU | NEC |
Package Size | 62.8 x 33.8 |
Packing Type | Tray |
RoHs compliant | Ecopack1 |
Grade | Industrial |
Package Name | ACEPACK 2 |
This power module realizes a triple boost plus half-bridge topology in an ACEPACK 2 module with NTC and capacitance, integrating the latest advances in silicon carbide MOSFETs from STMicroelectronics, represented by third generation technology. This modular solution is used to realize complex...
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Quantity | $ per unit | Savings |
---|---|---|
1-9 | $83.27 | 0% |
10-17 | $72.74 | 13% |
18-53 | $70.77 | 15% |
54-107 | $68.29 | 18% |
108-251 | $65.81 | 21% |
252-500 | $64.33 | 23% |
500 + |
Contact sales |
ECCN US | EAR99 |
ECCN EU | NEC |
Package Size | 62.8 x 33.8 |
Packing Type | Tray |
RoHs compliant | Ecopack1 |
Grade | Industrial |
Package Name | ACEPACK 2 |
This power module realizes a triple boost plus half-bridge topology in an ACEPACK 2 module with NTC and capacitance, integrating the latest advances in silicon carbide MOSFETs from STMicroelectronics, represented by third generation technology. This modular solution is used to realize complex...
Read More
|