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A2TBH45M65W3-FC

ACEPACK 2 power module, triple boost (650 V, 49 mOhm typ.) plus half-bridge topology (650 V, 23.5 mOhm typ.) SiC Power MOSFET gen. 3 with NTC and capacitance

ECCN USEAR99
ECCN EUNEC
Package Size62.8 x 33.8
Packing TypeTray
RoHs compliantEcopack1
GradeIndustrial
Package NameACEPACK 2

This power module realizes a triple boost plus half-bridge topology in an ACEPACK 2 module with NTC and capacitance, integrating the latest advances in silicon carbide MOSFETs from STMicroelectronics, represented by third generation technology. This modular solution is used to realize complex...
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Key features
  • ACEPACK 2 power module
    • Triple boost switch 49 mΩ of typical RDS(on)
    • Half-bridge switch 23.5 mΩ of typical RDS(on)
    • Insulation voltage 2.5 kVrms
    • Integrated NTC temperature sensor
    • Integrated DC link capacitor
    • DBC Cu-Al2O3-Cu based
    • Press-fit contact pins
Out of Stock
Quantity $ per unit Savings
1-9$83.270%
10-17$72.7413%
18-53$70.7715%
54-107$68.2918%
108-251$65.8121%
252-500$64.3323%
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$83.27
ECCN USEAR99
ECCN EUNEC
Package Size62.8 x 33.8
Packing TypeTray
RoHs compliantEcopack1
GradeIndustrial
Package NameACEPACK 2

This power module realizes a triple boost plus half-bridge topology in an ACEPACK 2 module with NTC and capacitance, integrating the latest advances in silicon carbide MOSFETs from STMicroelectronics, represented by third generation technology. This modular solution is used to realize complex...
Read More

Key features
  • ACEPACK 2 power module
    • Triple boost switch 49 mΩ of typical RDS(on)
    • Half-bridge switch 23.5 mΩ of typical RDS(on)
    • Insulation voltage 2.5 kVrms
    • Integrated NTC temperature sensor
    • Integrated DC link capacitor
    • DBC Cu-Al2O3-Cu based
    • Press-fit contact pins