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BUL741
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| ECCN US | EAR99 |
| ECCN EU | NEC |
| Packing Type | Tube |
| RoHs compliant | Ecopack2 |
| Grade | Industrial |
| Package Name | TO-220 |
The device is manufactured using high voltage Multi-Epitaxial Planar technology for high switching speeds and high voltage capability.Thanks to an increased intermediate layer, it has an intrinsic ruggedness which enables the transistor to withstand an high collector current level during breakdown...
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| Quantity | $ per unit | Savings |
|---|---|---|
| 1-9 | $1.35 | 0% |
| 10-24 | $0.70 | 48% |
| 25-500 | $0.45 | 67% |
| 500 + | Contact sales | |
| ECCN US | EAR99 |
| ECCN EU | NEC |
| Packing Type | Tube |
| RoHs compliant | Ecopack2 |
| Grade | Industrial |
| Package Name | TO-220 |
The device is manufactured using high voltage Multi-Epitaxial Planar technology for high switching speeds and high voltage capability.Thanks to an increased intermediate layer, it has an intrinsic ruggedness which enables the transistor to withstand an high collector current level during breakdown...
Read More
|