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BULD741T4
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| ECCN US | EAR99 |
| ECCN EU | NEC |
| Packing Type | Tape And Reel |
| RoHs compliant | Ecopack2 |
| Grade | Industrial |
| Package Name | DPAK |
The BULD741T4 is manufactured using high voltage multi-epitaxial planar technology to enhance switching speeds and high voltage capability.Thanks to an increased intermediate layer, it has an intrinsic ruggedness which enables the transistor to withstand a high collector current level during...
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| Quantity | $ per unit | Savings |
|---|---|---|
| 1-9 | $1.64 | 2% |
| 10-99 | $1.04 | 35% |
| 100-499 | $0.69 | 57% |
| 500 | $0.54 | 66% |
| 500 + | Contact sales | |
| ECCN US | EAR99 |
| ECCN EU | NEC |
| Packing Type | Tape And Reel |
| RoHs compliant | Ecopack2 |
| Grade | Industrial |
| Package Name | DPAK |
The BULD741T4 is manufactured using high voltage multi-epitaxial planar technology to enhance switching speeds and high voltage capability.Thanks to an increased intermediate layer, it has an intrinsic ruggedness which enables the transistor to withstand a high collector current level during...
Read More
|