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BULD741T4
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| ECCN US | EAR99 |
| ECCN EU | NEC |
| Packing Type | Tape And Reel |
| RoHs compliant | Ecopack2 |
| Grade | Industrial |
| Package Name | DPAK |
The BULD741T4 is manufactured using high voltage multi-epitaxial planar technology to enhance switching speeds and high voltage capability.Thanks to an increased intermediate layer, it has an intrinsic ruggedness which enables the transistor to withstand a high collector current level during...
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| Quantity | $ per unit | Savings |
|---|---|---|
| 1-9 | $1.30 | 0% |
| 10-24 | $0.90 | 31% |
| 25-99 | $0.86 | 34% |
| 100-249 | $0.66 | 49% |
| 250-499 | $0.64 | 51% |
| 500 | $0.53 | 59% |
| 500 + | Contact sales | |
| ECCN US | EAR99 |
| ECCN EU | NEC |
| Packing Type | Tape And Reel |
| RoHs compliant | Ecopack2 |
| Grade | Industrial |
| Package Name | DPAK |
The BULD741T4 is manufactured using high voltage multi-epitaxial planar technology to enhance switching speeds and high voltage capability.Thanks to an increased intermediate layer, it has an intrinsic ruggedness which enables the transistor to withstand a high collector current level during...
Read More
|