M95P32-IXMGT/E

Ultra low-power 32 Mbit Serial SPI Page EEPROM

Parameters

Supply Voltage Min Volt	1.6
Supply Voltage Max Volt	3.6
Operating Temp Min Celsius	-40.0
Operating Temp Max Celsius	85.0
ECCN US	3A991.b.1.b.1
ECCN EU	NEC
Packing Type	Tape And Reel
RoHs compliant	Ecopack2
Grade	Industrial
Package Name	UFDFPN 4X4X0.55 8L P0.8

Description

The M95P32-I and M95P32-E are manufactured with ST's advanced proprietary NVM technology. They offer byte flexibility, page alterability, high page cycling performance, and ultralow power consumption, equivalent to that of EEPROM technology.The devices are a 32-Mbit SPI page EEPROM, organized as...
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Key features

Key features
Interface Supports serial peripheral interface (SPI) and dual/quad outputs High speed frequency Clock frequency up to 80 MHz Fast read single/dual/quad output with one dummy byte Dual output data transfer up to 160 Mbits/s Quad output data transfer up to 320 Mbits/s Memory 32 Mbits of page EEPROM 64-Kbyte blocks, 4-Kbyte sectors Page size: 512-byte Two additional 512-byte identification pages Supply voltage Temperature Operating temperature range: -40 °C to +85 °C (industrial) -40 °C to +105 °C (extended) Performance Write endurance: 500 kcycles on full temperature range Data retention: 100 years 10 years after 500 kcycles Ultra-low power consumption 0.6 μA (typical) in deep power-down mode 16 μA (typical) in standby mode 800 μA (typical) for read single at 10 MHz 1.5 mA (typical) for page write Current peak control < 3 mA High write erase performance Fast Write, program, and erase times: 2 ms (typical) for byte and page write (includes auto erase and program) for 512 bytes 1.2 ms (typical) for page program (512 bytes) 1.1 ms (typical) for page erase 1.3 ms (typical) for sector erase 4 ms (typical) for block erase 15 ms (typical) for chip erase Page program with buffer load Advanced features ECC for high memory reliability (DEC, TED) Schmitt trigger inputs for noise filtering Output buffer programmable strength Operating status flags for ISO26262 Software reset Write protection by block, with top/bottom option Unique ID upon request Electronic identification Supports SFDP (serial flash discoverable parameters) mode JEDEC standard manufacturer identification Package DFN8, SO8N, and WLCSP8 (ECOPACK2-compliant) Unsawn wafer ESD protection HBM (human body model): 2000 V

Out of Stock

Parameters

Supply Voltage Min Volt	1.6
Supply Voltage Max Volt	3.6
Operating Temp Min Celsius	-40.0
Operating Temp Max Celsius	85.0
ECCN US	3A991.b.1.b.1
ECCN EU	NEC
Packing Type	Tape And Reel
RoHs compliant	Ecopack2
Grade	Industrial
Package Name	UFDFPN 4X4X0.55 8L P0.8

Description

Key features

Key features
Interface Supports serial peripheral interface (SPI) and dual/quad outputs High speed frequency Clock frequency up to 80 MHz Fast read single/dual/quad output with one dummy byte Dual output data transfer up to 160 Mbits/s Quad output data transfer up to 320 Mbits/s Memory 32 Mbits of page EEPROM 64-Kbyte blocks, 4-Kbyte sectors Page size: 512-byte Two additional 512-byte identification pages Supply voltage Temperature Operating temperature range: -40 °C to +85 °C (industrial) -40 °C to +105 °C (extended) Performance Write endurance: 500 kcycles on full temperature range Data retention: 100 years 10 years after 500 kcycles Ultra-low power consumption 0.6 μA (typical) in deep power-down mode 16 μA (typical) in standby mode 800 μA (typical) for read single at 10 MHz 1.5 mA (typical) for page write Current peak control < 3 mA High write erase performance Fast Write, program, and erase times: 2 ms (typical) for byte and page write (includes auto erase and program) for 512 bytes 1.2 ms (typical) for page program (512 bytes) 1.1 ms (typical) for page erase 1.3 ms (typical) for sector erase 4 ms (typical) for block erase 15 ms (typical) for chip erase Page program with buffer load Advanced features ECC for high memory reliability (DEC, TED) Schmitt trigger inputs for noise filtering Output buffer programmable strength Operating status flags for ISO26262 Software reset Write protection by block, with top/bottom option Unique ID upon request Electronic identification Supports SFDP (serial flash discoverable parameters) mode JEDEC standard manufacturer identification Package DFN8, SO8N, and WLCSP8 (ECOPACK2-compliant) Unsawn wafer ESD protection HBM (human body model): 2000 V