M95P32-IXCST/EF

Ultra low-power 32 Mbit Serial SPI Page EEPROM

Parameters

Supply Voltage Min Volt	1.6
Supply Voltage Max Volt	3.6
Operating Temp Min Celsius	-40.0
Operating Temp Max Celsius	85.0
ECCN US	3A991.b.1.b.1
ECCN EU	NEC
Packing Type	Tape And Reel
RoHs compliant	Ecopack2
Grade	Industrial
Package Name	WLCSP-R 5

Description

The M95P32-I and M95P32-E are manufactured with ST's advanced proprietary NVM technology. They offer byte flexibility, page alterability, high page cycling performance, and ultra-low power consumption, equivalent to that of EEPROM technology.The M95P32-I and M95P32-E are a 32-Mbit SPI page EEPROM...
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Key features

Key features
Interface Supports serial peripheral interface (SPI) and dual/quad outputs High speed frequency Clock frequency up to 80MHz Fast read single/dual/quad output with one dummy byte Dual output data transfer up to 160Mbits/s Quad output data transfer up to 320Mbits/s Memory 32 Mbits of page EEPROM 64-Kbyte blocks, 4-Kbyte sectors Page size: 512-byte Two additional 512-byte identification pages Supply voltage Temperature Operating temperature range: -40 °C to +85 °C (industrial) -40 °C to +105 °C (extended) Performance Write endurance: 500 kcycles on full temperature range Data retention: 100 years 10 years after 500 kcycles Ultra-low power consumption 0.6 μA (typ) in deep power-down mode 16 μA (typ) in Standby mode 800 μA (typ) for read single at 10 MHz 1.5 mA (typ) for page write Current peak control < 3 mA High write erase performance Fast Write/Prog/Erase times: 2 ms (typ) for byte and page write (includes auto erase and program) for 512 bytes 1.2 ms (typ) for page program (512 bytes) 1.1 ms (typ) for page erase 1.3 ms (typ) for sector erase 4 ms (typ) for block erase 15 ms (typ) for chip erase Page program with buffer load Advanced features ECC for high memory reliability (DEC,TED) Schmitt trigger inputs for noise filtering Output buffer programmable strength Operating status flags for ISO26262 Software reset Write protection by block, with top/bottom option Unique ID upon request Electronic identification Supports SFDP (serial flash discoverable parameters) mode JEDEC standard manufacturer identification Package ECOPACK2 (RoHS compliant) and halogen-free packages: DFN8 4 x 4 mm SO8N WLCSP8 Unsawn wafer ESD protection HBM (human body model): 2000 V

In stock

Quantity	$ per unit	Savings
1-9	$1.73	0%
10-99	$1.54	11%
100-249	$1.46	15%
250-499	$1.40	19%
500	$1.35	21%
500 +	Contact sales

$1.73

$1.72

Parameters

Supply Voltage Min Volt	1.6
Supply Voltage Max Volt	3.6
Operating Temp Min Celsius	-40.0
Operating Temp Max Celsius	85.0
ECCN US	3A991.b.1.b.1
ECCN EU	NEC
Packing Type	Tape And Reel
RoHs compliant	Ecopack2
Grade	Industrial
Package Name	WLCSP-R 5

Description

Key features

Key features
Interface Supports serial peripheral interface (SPI) and dual/quad outputs High speed frequency Clock frequency up to 80MHz Fast read single/dual/quad output with one dummy byte Dual output data transfer up to 160Mbits/s Quad output data transfer up to 320Mbits/s Memory 32 Mbits of page EEPROM 64-Kbyte blocks, 4-Kbyte sectors Page size: 512-byte Two additional 512-byte identification pages Supply voltage Temperature Operating temperature range: -40 °C to +85 °C (industrial) -40 °C to +105 °C (extended) Performance Write endurance: 500 kcycles on full temperature range Data retention: 100 years 10 years after 500 kcycles Ultra-low power consumption 0.6 μA (typ) in deep power-down mode 16 μA (typ) in Standby mode 800 μA (typ) for read single at 10 MHz 1.5 mA (typ) for page write Current peak control < 3 mA High write erase performance Fast Write/Prog/Erase times: 2 ms (typ) for byte and page write (includes auto erase and program) for 512 bytes 1.2 ms (typ) for page program (512 bytes) 1.1 ms (typ) for page erase 1.3 ms (typ) for sector erase 4 ms (typ) for block erase 15 ms (typ) for chip erase Page program with buffer load Advanced features ECC for high memory reliability (DEC,TED) Schmitt trigger inputs for noise filtering Output buffer programmable strength Operating status flags for ISO26262 Software reset Write protection by block, with top/bottom option Unique ID upon request Electronic identification Supports SFDP (serial flash discoverable parameters) mode JEDEC standard manufacturer identification Package ECOPACK2 (RoHS compliant) and halogen-free packages: DFN8 4 x 4 mm SO8N WLCSP8 Unsawn wafer ESD protection HBM (human body model): 2000 V